Substrate Transfer Layout for Dry-Wet Contamination Control
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Solution Overview
Problem
Existing substrate processing methods in semiconductor manufacturing face challenges in reducing particle defects and contamination due to the use of common blades for transferring substrates in dry and wet states, leading to re-contamination and process inefficiencies.
Innovation Solution
A substrate processing apparatus and method that utilizes separate blades for dry and wet substrates, along with a carrier for temporary storage, to prevent contamination and improve process efficiency by maintaining substrate integrity throughout various processing stages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a common blade is used to transfer both dry and wet substrates, then the device complexity is reduced, but particle defects and contamination increase due to re-contamination between processes
Solution Approach 1:
The substrate transferring unit is segmented into a first blade for dry substrates and a second blade for wet substrates. This segmentation prevents cross-contamination between dry and wet processes, thereby reducing particle defects while maintaining manageable device complexity through functional separation.
Solution Approach 2:
A carrier is introduced as an intermediary component to temporarily store dry substrates. This carrier acts as a mediator between the first blade and the process chambers, enabling smooth substrate transfer while maintaining the distinction between dry and wet processing paths, thus reducing contamination risk.
2Object-affected harmful factors
If separate blades are used for dry and wet substrates, then particle defects are reduced, but the device complexity and area occupied increase
Solution Approach 1:
The first blade, second blade, and carrier are merged into a single integrated substrate transferring unit. This merging allows the system to achieve the contamination reduction benefits of separate blades while consolidating the structure to minimize the occupied area and manage device complexity.
Solution Approach 2:
The substrate transferring unit is arranged in a vertical configuration where the first blade, second blade, and carrier are positioned at different vertical levels. This dimensional arrangement reduces the horizontal area occupied while maintaining the functional separation needed to prevent particle defects.
3Productivity
If substrates are transferred directly between chambers without temporary storage, then the productivity is improved, but contamination risk increases due to prolonged exposure in wet state
Solution Approach 1:
The carrier provides preliminary storage capacity for dry substrates before they enter the processing sequence. This preliminary action allows the system to buffer substrates, enabling faster processing cycles without forcing wet substrates to wait in conditions that could cause contamination.
Solution Approach 2:
The carrier serves as an intermediary storage station that temporarily holds dry substrates. This mediator component decouples the processing timeline of different chambers, allowing continuous high-speed processing while maintaining substrate integrity by preventing wet substrates from being exposed to contaminated environments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly reduces particle defects and improves manufacturing yield by preventing contamination and optimizing the processing sequence through dedicated blades and temporary storage, ensuring substrates remain in a clean and controlled state during transfer and processing.
Implementation Method 1
a second process chamber configured to perform a drying process on the substrate by supplying a supercritical fluid to the substrate
Data Source
AI summary
A substrate processing apparatus includes: a first process chamber in which a developing process is performed by supplying a developer to a substrate that is in a dry state; a second process chamber in which a drying process is performed on the substrate by supplying a supercritical fluid to the substrate on which the developing process is performed and which is in a wet state; a third process chamber in which a bake operation is performed on the substrate on which the drying operation is performed and is in a dry state; a fourth process chamber in which a cooling operation is performed on the substrate on which the bake operation is performed and is in a dry state; and a substrate transferring unit configured to transfer the substrate between the first to fourth process chambers.