Substrate Transfer Gap Measurement for Collision Prevention
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Solution Overview
Problem
The existing substrate processing apparatuses face challenges in efficiently transferring substrates due to potential collisions between the transfer robot's hand and substrates or lift pins, particularly when loading or unloading substrates, and in determining the correct position or presence of substrates within the processing chamber.
Innovation Solution
The apparatus incorporates a gap measurement unit with an irradiation part and a light-receiving part to measure gaps between the dielectric plate and the substrate or chuck, allowing the controller to determine whether to load or unload substrates based on predefined limits, thereby preventing collisions and ensuring accurate positioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the transfer robot transfers a substrate to the lift pins on which another substrate is already placed, then the substrate transfer operation can proceed, but the hand of the transfer robot may collide with the substrate placed on the lift pins
Solution Approach 1:
The system performs preliminary detection of substrate position and lift pin height before the transfer robot executes the substrate transfer operation. The gap measurement unit measures the gap between the dielectric plate and substrate/chuck in advance, and the controller uses this information to determine whether the substrate is in a suitable state for transfer, thereby preventing collision before it occurs
Solution Approach 2:
The gap measurement unit provides real-time feedback information about the substrate position and lift pin height to the controller. Based on this feedback, the controller dynamically adjusts the transfer operation or prevents execution when collision risk is detected, creating a closed-loop control system that resolves the contradiction between maintaining productivity and ensuring safety
2Productivity
If the transfer robot receives a substrate from the lift pins, then the substrate unloading operation can proceed, but the hand of the transfer robot may collide with the lift pins or substrate if the substrate is not raised to an appropriate height or is in an unsuitable state
Solution Approach 1:
Before the transfer robot receives the substrate from the lift pins, the gap measurement unit preliminarily measures the gap between the dielectric plate and substrate/chuck to determine if the substrate is raised to the appropriate height and is in a suitable state. This preliminary check prevents collision by ensuring favorable conditions before the unloading operation proceeds
Solution Approach 2:
The system continuously monitors the substrate position through gap measurement and provides feedback to the controller. When the substrate reaches the appropriate height and suitable state, the controller enables the unloading operation, thereby resolving the contradiction between operational productivity and collision prevention
3Measurement precision
If the gap measurement unit measures the gap between the dielectric plate and substrate to determine position and presence, then accurate substrate positioning can be achieved, but additional measurement components and control logic are required
Solution Approach 1:
The dielectric plate serves as an intermediary reference object between the gap measurement unit and the substrate/chuck. By measuring the gap between the dielectric plate and other components, the system indirectly determines substrate position and presence without requiring direct complex measurement of the substrate itself, thus achieving precise measurement while managing system complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient substrate transfer by minimizing collisions and ensuring accurate loading and unloading operations, enhancing the reliability of the substrate processing process.
Implementation Method 1
a gap measurement unit that measures a gap between the dielectric plate and the substrate supported by the lift pin or a gap between the dielectric plate and the chuck
Data Source
AI summary
An apparatus for processing a substrate includes a housing having a processing space therein, a transfer robot that loads the substrate into the processing space or unloads the substrate from the processing space, a support unit including a chuck that supports the substrate in the processing space and a lift pin that moves the substrate in an up-down direction, a dielectric plate having a lower surface disposed to face an upper surface of the chuck, and a gap measurement unit that measures a gap between the dielectric plate and the substrate supported by the lift pin or a gap between the dielectric plate and the chuck.