Substrate Transfer Layout for Flexible Batch-Single Wafer Integration
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Solution Overview
Problem
Conventional substrate treatment systems face difficulties in freely changing the configurations of batch treatment devices and single-wafer treatment devices due to the fixed arrangement of interface devices, which restricts flexibility and requires cumbersome adjustments when the length of batch treatment devices is modified.
Innovation Solution
A substrate treatment system is designed with a batch treatment device and a single-wafer treatment device connected by an interface device, where the batch treatment device extends in a first horizontal direction, and the single-wafer treatment device is aligned orthogonally, allowing for flexible configuration changes without altering the interface device's configuration, utilizing a posture turning mechanism to adjust substrate posture and a relay region to prevent interference and maintain a wide maintenance area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the batch treatment device is lengthened in the front-rear direction to increase treatment capacity, then the treatment capacity is improved, but the transport path of the interface device or single-wafer treatment device must be changed which increases device complexity and reduces adaptability
Solution Approach 1:
The interface device is repositioned from the rear side to the width direction side of the batch treatment device. This dimensional change allows the batch treatment device to be extended in the front-rear direction without requiring changes to the interface device's transport path, as the interface device now connects from the side rather than the rear, resolving the contradiction between increased treatment capacity and reduced transport path complexity
Solution Approach 2:
The system design allows the batch treatment device length to be dynamically adjusted in the front-rear direction while maintaining a fixed interface device configuration. The interface device's position in the width direction creates a flexible configuration where treatment capacity can be increased without rigidly constraining future expansions or modifications
2Ease of manufacture
If the interface device is positioned on the rear side to simplify initial configuration, then the initial setup is easier, but any change in batch treatment device length requires changing the transport path which reduces ease of operation and adaptability
Solution Approach 1:
The interface device is positioned in the width direction rather than the rear side, creating a spatial separation between the interface connection point and the batch treatment device's length extension direction. This allows the batch treatment device to be extended or modified in the front-rear direction without affecting the interface device's transport path, significantly improving configuration adaptability while maintaining operational simplicity
Data Source
AI summary
A substrate treatment system includes a batch treatment device, a single-wafer treatment device, and an interface device that connects the batch treatment device and the single-wafer treatment device. The batch treatment device extends to a rear side. The single-wafer treatment device faces the batch treatment device to be aligned in a width direction orthogonal to the rear side. The interface device is disposed adjacent to one end side of each of the batch treatment device and the single-wafer treatment device to extend in the width direction. The batch substrate transport region of the batch treatment device is disposed adjacent to a transfer block and a treatment block on a side where the single-wafer treatment device is disposed. The interface device includes a posture turning region and a relay region. The posture turning region is disposed on an opposite side to the treatment block via the transfer block.