Substrate Transfer Position Correction for Semiconductor Processing

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Solution Overview

Problem

In substrate processing for semiconductor devices, deviations in substrate position on tweezers can lead to inaccurate placement on the susceptor, affecting in-plane uniformity and potentially breaking the substrate, due to mechanical wear over time.

Innovation Solution

A substrate processing apparatus with a transfer chamber and detecting unit to accurately position substrates on rotating substrate support units, using reference position information and detected position data to correct for deviations, ensuring precise placement and uniform film formation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If substrate transfer is performed using tweezers that are used for a long period of time, then productivity is maintained, but the substrate position deviates due to mechanical wear, causing placement inaccuracy and potential substrate breakage

Engineering Contradiction:

Improvesubstrate transfer efficiencyVSAvoidsubstrate placement position accuracy

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The system uses a substrate position detecting unit to detect the actual position of the substrate on the tweezers, and the controller calculates correction values based on the detected position and reference position information. This feedback mechanism allows the system to automatically compensate for mechanical wear of the tweezers, maintaining placement accuracy while continuing to use the same tweezers for extended periods without replacement.

Inventive Principle:

Principle #23Feedback

Solution Approach 2:

The system stores reference position information for multiple substrates and dynamically adjusts the transfer parameters based on detected position deviations. By changing the positional parameters in real-time based on actual substrate positions and reference data, the system compensates for mechanical wear effects without affecting productivity.

Inventive Principle:

Principle #35Parameter changes

2Manufacturing precision

If substrate position detection and correction mechanisms are added, then manufacturing precision is improved, but device complexity increases

Engineering Contradiction:

Improvesubstrate placement position accuracyVSAvoidtransfer chamber structure complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

Instead of using complex mechanical adjustment mechanisms to maintain substrate placement accuracy, the system substitutes mechanical correction with computational correction. The detecting unit and controller work together to calculate and apply position corrections based on reference information, replacing what would otherwise require complex mechanical adjustment systems.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The controller acts as an intermediary between the substrate transfer unit and the position detecting unit. It receives detection results, compares them with reference position information, calculates correction values, and sends corrected position commands to the transfer unit. This intermediary processing layer enables precision improvement without requiring direct complex mechanical modifications.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Manufacturing precision

If reference position information for multiple substrates is stored and used, then manufacturing precision is improved, but loss of information increases due to larger data storage requirements

Engineering Contradiction:

Improvesubstrate placement consistencyVSAvoidmemory storage capacity

Core Design Contradiction:

Manufacturing precisionVSLoss of information

Solution Approach 1:

The system stores reference position information for multiple substrates (more than the minimum one) to account for variations in substrate positioning. By storing reference information for multiple substrates and using appropriate references based on detection results, the system achieves better placement consistency while the memory requirement remains manageable through selective usage of stored reference data.

Inventive Principle:

Principle #16Partial or excessive action

Data Source

PatentUS9842754B2Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium

Publication Date: 2017.12.12 KOKUSAI DENKI KK

AI summary

In the present invention, a substrate is placed at a predetermined position on a substrate support even though the substrate is deviated on a substrate transfer unit.There is provided a substrate processing apparatus that includes a process chamber, a transfer chamber accommodating a substrate transfer unit, a substrate detecting unit, a memory unit configured to store a first reference position information, a second reference position information and a substrate reference position information and a controller configured to generate a detected position information representing a position of a substrate being transferred in the transfer chamber based on a detection result and to control the substrate transfer unit to place the substrate based on the detected position information, the first reference position information, the substrate reference position information and a difference between the first reference position information and the second reference position information.