Substrate Transporting Apparatus Displacement Compensation
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Solution Overview
Problem
Conventional substrate transporting apparatuses face challenges in accurately housing substrates due to manufacturing and assembly errors, leading to displacements of processing tanks, which affect plating quality by deviating current density during electrolytic plating, and require time-consuming and costly positional adjustments.
Innovation Solution
A substrate transporting apparatus equipped with a holder griping mechanism that includes a rotation mechanism for rotational movement around a vertical axis and a linear motion mechanism for perpendicular movement, allowing for displacement compensation of processing tanks and substrate holders, enabling precise positioning of substrates within processing tanks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional substrate transporting apparatus is used without displacement compensation, then assembly is simpler and faster, but substrate positioning accuracy deteriorates due to manufacturing and assembly errors causing processing tank displacement
Solution Approach 1:
The holder griping mechanism is designed with rotational and linear motion capabilities, transforming it from a static positioning device to a dynamic one that can actively compensate for processing tank displacements. The rotation mechanism adjusts the angular position of the substrate holder, while the linear motion mechanism corrects positional offsets, enabling the system to adapt to manufacturing errors without requiring perfect assembly precision.
2Manufacturing precision
If positional adjustment of processing tanks is performed to reduce displacement, then substrate positioning accuracy improves, but assembly time and cost increase
Solution Approach 1:
The system employs self-service displacement compensation where the holder griping mechanism automatically detects and corrects for processing tank position deviations. Instead of requiring manual measurement and adjustment of each processing tank during assembly, the mechanism autonomously compensates for displacements through its rotation and linear motion capabilities, significantly reducing assembly time and labor requirements while maintaining positioning accuracy.
3Manufacturing precision
If holder griping mechanism includes rotation and linear motion mechanisms for displacement compensation, then substrate positioning accuracy improves, but device complexity increases
Solution Approach 1:
The holder griping mechanism is designed as a multi-functional device that combines substrate gripping, rotational positioning, and linear motion capabilities within a single integrated structure. This universal mechanism serves multiple purposes: it secures the substrate holder, compensates for angular displacements through rotation, and corrects positional offsets through linear motion. By consolidating these functions into one mechanism rather than using separate devices, the overall system complexity is reduced despite the advanced capabilities provided.
Data Source
AI summary
In assembly of a conventional plating apparatus, a position of a processing tank is adjusted so that the processing tank is disposed at an ideal position. This adjustment takes time and effort to assemble a plating apparatus, and assembly of the plating apparatus requires a high cost. The invention provides a substrate transporting apparatus provided with a substrate holder for holding a substrate, a holder griping mechanism that grips the substrate holder, a substrate transporting section that transports the substrate holder, a rotation mechanism that rotationally moves the holder griping mechanism around a vertical direction as an axis, and a linear motion mechanism that linearly moves the holder griping mechanism in a direction perpendicular to a plane defined by a transporting direction of the substrate holder by the substrate transporting section and a vertical direction.