Substrate Treating Method for Precise Etching via Hydrophilization Control
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Solution Overview
Problem
The existing substrate treating methods face challenges in achieving precise etching of specific regions on masks due to variations in hydrophilization levels, leading to non-uniform etchant coating and reduced process uniformity, especially when critical dimension correction is required.
Innovation Solution
A substrate treating method that involves determining the degree of hydrophilization of the substrate by measuring the contact angle of a test liquid and adjusting the supply mechanism of a second etchant liquid based on this measurement, including factors like supply time, position, and discharge angle, to ensure even coating and precise etching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the mask is hydrophobized with an oxide layer before etching, then the mask surface becomes resistant to liquid etchant coating, but this reduces the affinity between etchant and mask surface, leading to non-uniform etchant distribution and imprecise etching
Solution Approach 1:
The patent applies preliminary hydrophilization treatment to the mask surface before etching to counteract the hydrophobic oxide layer. This preliminary action modifies the surface properties to ensure proper etchant wetting and uniform coating, thereby enabling precise etching while maintaining the protective oxide layer
Solution Approach 2:
The patent changes the surface energy parameters of the mask by controlling the hydrophilization degree. By adjusting parameters such as contact angle and surface free energy through hydrophilization treatment, the mask surface achieves optimal wettability for etchant coating, resolving the contradiction between hydrophobic protection and hydrophilic etching
2Ease of operation
If a fixed etchant supply mechanism is used for all masks, then the process is simple to operate, but the degree of hydrophilization varies from mask to mask, causing different etching degrees and reduced process uniformity
Solution Approach 1:
The patent introduces a dynamic etchant supply mechanism that adjusts supply parameters based on real-time measurement of mask hydrophilization degree. The system dynamically modifies etchant flow rate, supply timing, and distribution patterns to match each mask's specific surface properties, ensuring uniform etching across varying hydrophilization levels while maintaining operational simplicity through automated control
Solution Approach 2:
The patent implements a feedback control system where the hydrophilization degree of each mask is measured and used to adjust the etchant supply parameters. This closed-loop feedback ensures that each mask receives the appropriate amount of etchant based on its actual surface properties, maintaining process uniformity without requiring complex manual intervention
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for precise etching of specific regions on substrates by optimizing the etchant supply mechanism according to hydrophilization levels, ensuring accurate critical dimension matching between patterns and improving process uniformity.
Implementation Method 1
contact angle between the second liquid which is supplied and the substrate is measured to determine a degree of hydrophilization of the substrate
Implementation Method 2
heating the substrate after the supplying the liquid
Data Source
AI summary
The inventive concept provides a substrate treating method. The substrate treating method includes supplying a liquid to a substrate; and heating the substrate after the supplying the liquid, and wherein the supplying the liquid includes: supplying a first liquid to the substrate; and supplying a second liquid which is different from the first liquid to a substrate to which the first liquid is supplied, and wherein the second liquid is supplied as a test to the substrate and a contact angle between the second liquid which is supplied and the substrate is measured to determine a degree of hydrophilization of the substrate, and a supply mechanism of the second liquid supplied to the substrate is determined based on the degree of hydrophilization of the substrate which is determined, before the supplying the second liquid is performed.