Substrate Cleaning via Ultrasonic and Two-Fluid Jet Systems
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Solution Overview
Problem
Current substrate cleaning methods, particularly using sponges, face challenges with increased initializing time, dust production, and re-adhesion of particles, which hinder efficient cleaning and reduce apparatus operational rates in the context of increasingly finer semiconductor circuitry.
Innovation Solution
A substrate processing apparatus incorporating an ultrasonic cleaning device that uses ultrasonic waves transmitted through liquid and a two-fluid jet cleaning device that mixes gas and liquid to effectively remove minute particles without initializing time, while preventing dust adherence, along with a scrub cleaning device for thorough cleaning of recessed areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If sponge-based scrub cleaning is used to clean substrate surfaces, then cleaning effectiveness is improved, but initializing time increases and dust production occurs
Solution Approach 1:
The patent replaces the mechanical sponge-based scrub cleaning system with an ultrasonic cleaning system that uses high-frequency vibrations transmitted through a liquid medium. This substitution eliminates the need for physical contact between cleaning media and substrate, thereby removing the initializing time requirement and preventing dust generation from sponge materials, while maintaining effective particle removal capability
Solution Approach 2:
The patent introduces a two-fluid jet cleaning device that utilizes a mixture of gas and liquid under pressure to remove particles from the substrate surface. This pneumatic-hydraulic approach replaces mechanical scrubbing, enabling immediate cleaning action without initializing time and avoiding dust production from solid cleaning media
2Manufacturing precision
If sponge-based cleaning is used, then particles are removed, but dust from the sponge adheres to the substrate
Solution Approach 1:
The ultrasonic cleaning device uses high-frequency mechanical vibrations transmitted through liquid to dislodge and remove particles from the substrate surface without physical contact. Since no solid cleaning media touches the substrate, no dust is generated or adhered, solving the contamination problem while maintaining effective particle removal
Solution Approach 2:
The patent introduces liquid as an intermediary medium between the cleaning energy source and the substrate surface. The ultrasonic vibrations are transmitted through the liquid to the substrate, and the two-fluid jet uses the liquid-gas mixture as a carrier to transport and remove particles, preventing direct contact that would generate dust
3Ease of operation
If conventional cleaning methods are used, then cleaning is performed, but operating rate of the apparatus decreases
Solution Approach 1:
The ultrasonic cleaning system and two-fluid jet cleaning device can be activated immediately without any initializing period. The cleaning action continues effectively throughout the entire process without interruption or warm-up time, maintaining continuous productive operation and maximizing apparatus utilization
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus enables efficient cleaning of substrates without initializing time, reduces dust adherence, and improves operational rates by using ultrasonic and two-fluid jet cleaning methods in conjunction with scrub cleaning, enhancing the removal of particles from recessed areas and maintaining high cleaning effectiveness.
Implementation Method 1
an ultrasonic cleaning device (42) for cleaning the surface of the substrate with ultrasonic waves transmitted through a liquid
Implementation Method 2
a two-fluid jet cleaning device (44) for cleaning the surface of the substrate with a two-fluid jet spouted as a mixture of a gas and a liquid
Data Source
Figure 1
Figure 2A~2B
Figure 3A~3D
AI summary
A substrate processing apparatus includes: a polishing device 30A for polishing the surface of a substrate; and at least one of an ultrasonic cleaning device 42 for cleaning the surface of the substrate with ultrasonic waves transmitted through a liquid, and a two-fluid jet cleaning device 44 for cleaning the surface of the substrate with a two-fluid jet spouted as a mixture of a gas and a liquid. A substrate processing method includes: a polishing step of polishing the surface of a substrate; and a solid matter noncontact cleaning step of cleaning the surface of the substrate by spraying a liquid to the surface of the substrate. The above apparatus and method make it possible to efficiently clean the surface of a substrate after it is polished.