Circuit Substrate Vacuum Packaging With Selective Unit Sealing
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Solution Overview
Problem
Traditional electronic device manufacturing processes often result in inadequate vacuum sealing and material waste due to abnormal packaging of electronic units, leading to inefficiencies and increased costs.
Innovation Solution
A method involving a carrier with spacers and a circuit substrate with marked electronic units, where normal units are identified and supported by cover units with a gap for vacuuming and subsequent contact to ensure proper sealing, reducing waste and improving vacuum quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional packaging process is used to assemble cover plate and circuit substrate, then assembly is completed, but vacuum degree is insufficient and material waste occurs
Solution Approach 1:
The patent segments the packaging process by introducing spacers that create individual vacuum chambers for each electronic unit. Each unit can be vacuum-sealed independently, allowing defective units to be identified and excluded from packaging without affecting other units, thus reducing material waste while improving vacuum sealing quality.
Solution Approach 2:
The patent performs preliminary detection and classification of electronic units before packaging. By identifying normal and defective units in advance and positioning them appropriately with spacers, the system ensures that only normal units are vacuum-sealed, preventing material waste from packaging defective units while maintaining high vacuum quality for sealed units.
2Reliability
If traditional packaging process is used, then assembly is completed, but vacuum degree after assembling is not good
Solution Approach 1:
By segmenting the vacuum sealing process into individual unit chambers using spacers, each unit achieves proper vacuum degree independently. This segmentation allows parallel processing of multiple units, maintaining high productivity while ensuring good vacuum sealing quality for each unit.
Solution Approach 2:
The spacers act as intermediaries that facilitate vacuum sealing by creating proper spacing and sealing interfaces between the cover plate and circuit substrate. This intermediary structure enables effective vacuum application without compromising manufacturing efficiency.
3Productivity
If all electronic units are packaged without detection, then packaging speed is maintained, but defective units are wasted
Solution Approach 1:
The patent implements preliminary detection and classification of electronic units before the packaging process. Normal units are positioned in packaging positions while defective units are excluded, allowing the packaging process to proceed at high speed without wasting materials on defective units.
Solution Approach 2:
The patent applies different treatment to different units based on their quality status. Normal units receive vacuum sealing while defective units are excluded from packaging. This local differentiation allows high-speed processing of good units while avoiding waste on defective ones.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances vacuum sealing and reduces material waste by selectively supporting and sealing only normal electronic units, thereby improving manufacturing efficiency and reducing costs.
Implementation Method 1
vacuuming the gap between the circuit substrate and the plurality of cover units
Data Source
AI summary
A method for manufacturing an electronic device includes the following steps: providing a carrier and a circuit substrate, wherein the carrier includes a plurality of spacers, the circuit substrate includes a plurality of electronic units, and the electronic units are detected and determined to be normal or defective; providing cover units on the carrier; disposing the circuit substrate on the cover units so that the spacers support the circuit substrate, wherein there is a gap between the circuit substrate and the cover units, and the cover units correspond to the electronic units determined to be normal; vacuuming the gap between the circuit substrate and the cover units; moving the spacers to make the cover units and the circuit substrate contact each other; and pressing the cover units and the circuit substrate to fix the cover units and the circuit substrate to each other.