Substrate Wiring Layout for Uniform Display Power Distribution
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Solution Overview
Problem
The excessive gathering of signal lines and/or power lines on a single side of a substrate in electronic devices leads to uneven current distribution, heat accumulation, and power dissipation, affecting the quality of displayed images, such as uneven image brightness.
Innovation Solution
The electronic device features a circuit layer with first and second wirings that are separated along different directions, where the second wiring has multiple turning portions and is configured to distribute power signals more uniformly by extending to multiple sides of the substrate, allowing for multi-terminal transmission to light-emitting units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If signal lines and power lines are arranged on the same side of the substrate to save space, then space utilization is improved, but current distribution uniformity deteriorates
Solution Approach 1:
The patent transitions from arranging all wiring in a single plane (one dimension) to utilizing both sides of the substrate (two dimensions). The first wiring is arranged on the front surface while the second wiring is arranged on the rear surface, allowing spatial separation that improves current distribution uniformity while maintaining high space utilization.
2Area of stationary object
If signal lines and power lines are arranged on the same side of the substrate to save space, then space utilization is improved, but heat accumulation worsens
Solution Approach 1:
By distributing wiring to both sides of the substrate, the patent increases the effective heat dissipation area. The second wiring on the rear surface provides additional thermal pathways, reducing heat accumulation while maintaining compact space utilization.
3Area of stationary object
If signal lines and power lines are arranged on the same side of the substrate to save space, then space utilization is improved, but power dissipation worsens
Solution Approach 1:
The patent reduces power dissipation by distributing current-carrying wiring to both sides of the substrate. This spatial distribution decreases current density in individual wiring paths, reducing resistive heating and power loss while maintaining efficient space utilization.
4Ease of manufacture
If wiring is arranged on one side of the substrate, then manufacturing simplicity is improved, but image display quality deteriorates
Solution Approach 1:
The patent maintains manufacturing simplicity by using standard substrate bonding processes while improving image display quality through spatial separation of wiring. The front-surface wiring connects to display elements, while rear-surface wiring provides power and signal distribution, reducing interference and improving display uniformity.
Data Source
AI summary
An electronic device is provided, which includes a substrate, an electronic unit and a circuit layer. The substrate has a first surface and a second surface. The circuit layer includes a first wiring and a second wiring. The first wiring and the second wiring are separated from each other along a first direction. Both the second wiring and the first wiring have a plurality of turning portions. The numbers of the turning portions of the second wiring and the first wiring are greater than or equal to 2. When viewing along a normal direction of the second surface, the first wiring has two endpoints, and the second wiring has two endpoints. Along a second direction, a distance between the two endpoints of the first wiring is different from a distance between the two endpoints of the second wiring.