Substrateless Optoelectronic Component Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Optoelectronic components, such as LED arrays, face significant thermal challenges due to the combination of multiple semiconductor chips on a common carrier, leading to thermal overload and potential damage.
Innovation Solution
A substrate-less optoelectronic component with a carrier having high thermal conductivity (>50 W/(mK)) and a functional element for mechanical and electrical stabilization, allowing for efficient heat dissipation and separate control of semiconductor chips, along with a structured contact film for optimal electrical contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If multiple optoelectronic semiconductor chips are combined on a common substrate to achieve high luminous intensities, then the light output is improved, but the thermal load on the component increases significantly
Solution Approach 1:
The patent divides the optoelectronic component into separate functional layers: the optoelectronic semiconductor chips are mounted on a carrier substrate, which is then integrated with a separate Peltier element for active cooling. This segmentation allows the light-generating function and thermal management function to be independently optimized and combined.
Solution Approach 2:
The patent introduces a Peltier element as an intermediary thermal management component between the heat-generating semiconductor chips and the environment. This active cooling intermediary actively pumps heat away from the chip array, enabling high luminous intensity operation without excessive thermal accumulation.
2Illumination intensity
If multiple semiconductor chips are mounted on a carrier, then the light output is improved, but the mechanical stability and bending resistance of the component deteriorates
Solution Approach 1:
The patent employs a composite structure combining different materials with complementary properties: the carrier substrate provides mechanical support and electrical insulation, while the Peltier element (typically ceramic and metal composite) provides both thermal management and structural reinforcement. This composite approach maintains mechanical stability despite the presence of multiple mounted chips.
3Temperature
If a substrate-free semiconductor chip design is used, then the thermal conductivity is improved, but the mechanical stability and damage resistance deteriorates
Solution Approach 1:
The substrate-free semiconductor chip is nested within a protective carrier structure that provides mechanical support. The chip is mounted in a recess or cavity in the carrier, which protects it from external mechanical damage while maintaining direct thermal contact with the carrier's heat dissipation pathways.
Solution Approach 2:
The carrier substrate acts as an intermediary that provides mechanical protection to the fragile substrate-free semiconductor chip while simultaneously serving as a thermal management interface. This mediator structure allows the chip to benefit from both improved thermal conductivity (due to direct contact with the carrier) and enhanced mechanical strength (provided by the carrier).
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a compact, high-luminosity light source with improved thermal management, reducing thermal loads and enhancing the component's reliability and service life by efficiently dissipating heat and allowing for targeted light emission.
Implementation Method 1
The carrier is made of a material with high thermal conductivity, preferably at least 50 W/(m K), and particularly at least 120 W/(m K)
Implementation Method 2
The Peltier element has its active cooling side facing the mounting side of the carrier
Data Source
Figure 1
Figure 2~3
Figure 4A~4B
AI summary
In at least one embodiment of the optoelectronic component (1), it comprises a carrier (2) having an installation side (20) and at least one functional element (3). The optoelectronic component (1) further comprises at least one substrateless optoelectronic semiconductor chip (4) having a top side (44) and a bottom side (45) opposite thereof, wherein electric contacting of the semiconductor chip (4) takes place via the top side (44) and the bottom side (45), and wherein the bottom side (45) faces the installation side (20) of the carrier (2). The at least one semiconductor chip (4) is applied to the installation side (20). The optoelectronic component (1) further comprises at least one electric contact film (5) on the top side (44) of the semiconductor chip (1), wherein the contact film (5) is structured. Such an optoelectronic component (1) has a compact design and good thermal properties.