Suction Member with Hard Attachment for Non-Circular Workpiece Grinding
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Solution Overview
Problem
In semiconductor manufacturing, workpieces experience thickness variations due to inaccuracies in the fixed surface and attachment of processing tools, especially when non-circular workpieces are processed, leading to inconsistent contact areas and grinding amounts.
Innovation Solution
A processing apparatus with a suction member and an attachment on its periphery, made of a harder material, which contacts the grinding stone during self-grinding to compensate for thickness variations by adjusting grinding amounts in different contact regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional grinding processing is performed on non-circular workpieces, then the workpiece can be flattened, but thickness variation occurs due to non-constant contact area between grinding stone and workpiece
Solution Approach 1:
The invention applies local quality by creating a suction member with non-uniform thickness distribution. The thickness is deliberately made larger in regions where the contact area with the grinding stone is smaller, and smaller in regions where the contact area is larger. This local variation in thickness compensates for the non-constant contact area, ensuring uniform grinding amount across the entire workpiece surface.
Solution Approach 2:
The invention implements preliminary anti-action by pre-compensating for the expected thickness variation before the actual grinding process. The suction member is manufactured with built-in thickness compensation patterns that counteract the non-constant contact area effect, so that when grinding occurs, the varying thickness of the suction member offsets the varying contact area, resulting in uniform workpiece thickness.
2Manufacturing precision
If the fixed surface accuracy and attachment accuracy are improved, then thickness variation can be reduced, but device complexity and adjustment requirements increase
Solution Approach 1:
The invention applies preliminary action by pre-forming the suction member with the required non-uniform thickness distribution during manufacturing, rather than requiring complex adjustments during operation. The thickness compensation pattern is built into the suction member structure beforehand, eliminating the need for precise adjustment of the fixed surface or reassembly of components to achieve uniform thickness.
3Ease of manufacture
If the suction member thickness is made uniform, then manufacturing is simpler, but thickness variation in workpiece cannot be compensated
Solution Approach 1:
The invention resolves this contradiction by applying local quality - the suction member is manufactured with deliberately non-uniform thickness distribution. The thickness is larger in regions where the contact area with the grinding stone is smaller, and smaller in regions where the contact area is larger. This local variation compensates for the non-constant contact area, ensuring uniform workpiece thickness while maintaining manufacturing feasibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces thickness variations in workpieces by ensuring consistent grinding across non-circular shapes and varying contact areas, achieving a desired thickness through localized grinding adjustments.
Implementation Method 1
a suction member (33) capable of suction-holding the workpiece W
Implementation Method 2
a processing apparatus that flattens a workpiece with a grinding stone (21)
Implementation Method 3
an attachment (37) that is provided on an outer periphery side of the suction member (33), is composed of a material harder to grind than the suction member (33), and can contact the grinding stone (21) during self-grinding for grinding the suction member (33)
Data Source
AI summary
A processing apparatus that flattens a workpiece to a desired thickness. A processing apparatus 1 that flattens a workpiece W having a non-circular shape with a grinding stone 21, the processing apparatus 1 including a suction member 33 capable of suction-holding the workpiece W, and an attachment 37 that is provided on an outer periphery side of the suction member 33. The attachment 37 is composed of a material harder to grind than the suction member 33, and can contact the grinding stone 21 during self-grinding for grinding the suction member 33.