Superconducting Processor Chip Assembly With PCB Through-Hole I/O Bonding
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Solution Overview
Problem
The complexity of superconducting processor systems increases with the number of input/output lines, leading to physical space, power, and assembly challenges, particularly in cryogenic environments, where wirebonding becomes more difficult and prone to failures.
Innovation Solution
A processor system comprising a superconducting processor chip, a printed circuit board, and an input/output chip, bonded through a plurality of contacts such as Indium bump bonds or superconducting solder bonds, with a shield layer and thermally conductive layers to manage magnetic flux and thermal conductivity, reducing the need for extensive physical space and simplifying assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of input/output lines is increased to handle more qubits, then the processing capability is improved, but the physical space requirements and assembly complexity increase
Solution Approach 1:
The system is divided into separate functional modules: a processor chip containing qubits and control circuitry, an I/O chip handling input/output operations, and a PCB providing structural support and electrical connections. This segmentation allows each module to be optimized independently and assembled through standardized interfaces, reducing overall assembly complexity while maintaining high processing capability.
Solution Approach 2:
The processor chip is positioned within a through-hole of the PCB, and the I/O chip is mounted on the PCB surrounding the processor chip. This nested arrangement optimizes space utilization and reduces the overall footprint of the system while maintaining all necessary connections through the multi-chip architecture.
2Reliability
If wirebonding is used to connect chips in cryogenic environments, then electrical connections are established, but the assembly becomes more difficult and prone to failures
Solution Approach 1:
The patent replaces traditional wirebonding mechanical connections with superconducting bump bonds and solder bonds. These alternative connection methods eliminate the fragility associated with wirebonding in cryogenic environments, providing more robust electrical connections that are easier to manufacture and less prone to failure during assembly and operation.
3Use of energy by moving object
If superconducting technology is used to reduce heat generation, then power consumption is reduced, but the assembly complexity and manufacturing difficulty increase
Solution Approach 1:
The patent combines superconducting materials and techniques across multiple components: superconducting traces on the PCB, superconducting bump bonds for electrical connections, and superconducting solder bonds for chip attachment. This integrated approach achieves reduced power consumption through the entire system while managing manufacturing complexity through standardized superconducting assembly processes.
4Reliability
If a multi-layer PCB structure is used to provide superconducting connections, then the electrical performance is improved, but the manufacturing complexity increases
Solution Approach 1:
The PCB is designed with multi-layer superconducting structures that serve multiple functions: providing electrical connections between chips, offering magnetic shielding through superconducting layers, and enabling thermal management pathways. This multi-functionality reduces the need for separate dedicated components, thereby managing manufacturing complexity while achieving superior electrical performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration minimizes the physical space requirements, reduces power consumption, and enhances the reliability of assembly by using superconducting bonds and thermally conductive materials, thereby addressing the challenges of increased complexity in superconducting processor systems.
Implementation Method 1
a shield layer and thermally conductive layers to manage magnetic flux
Implementation Method 2
thermally conductive layers to manage magnetic flux and thermal conductivity
Implementation Method 3
bonded through a plurality of contacts such as Indium bump bonds or superconducting solder bonds
Data Source
AI summary
This disclosure generally relates to processor systems comprising printed circuit boards, I/O chips and processor chips with mated contacts. Contacts are formed on an upper surface of a printed circuit board having a through-hole and on a processor chip inside the through-hole. The processor chip may be a superconducting quantum processor chip comprising qubits, couplers, Digital to Analog converters, QFP shift registers and analog lines. Contacts are formed on an upper surface on an I/O chip and mated with the contacts on the printed circuit board and the processor chip. Contacts may be Indium bump bonds or superconducting solder bonds. The processor chip and the I/O chip may include a shield layer, a substrate layer and a thermally conductive layer.