Superconducting Frequency Multiplexing Circuit for Low-Heat Data Transfer
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Solution Overview
Problem
Superconducting computing systems lack high-density memory, which limits their performance due to the need for hybrid systems with semiconductor memory, posing challenges in transmitting encoded logical bit information between different temperature domains and thermal conductivity issues.
Innovation Solution
A superconducting circuit that generates frequency multiplexed AC signals, reducing thermal conductivity by using fewer metallic interconnections, allowing for efficient communication between superconducting and semiconductor domains, achieving 8 Gbps throughput with 6 ns latency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If hybrid systems with semiconductor memory are used to compensate for lack of high-density memory in superconducting computing systems, then memory capacity is improved, but thermal conductivity increases due to more metallic interconnections between different temperature domains
Solution Approach 1:
The patent segments the memory interface into multiple frequency channels, allowing parallel data transmission through a reduced number of physical interconnections. By dividing the data stream into frequency-multiplexed channels, the system achieves high memory capacity while minimizing the thermal conductive path between superconducting and semiconductor domains.
Solution Approach 2:
The patent introduces frequency multiplexing as an intermediary mechanism between superconducting logic and semiconductor memory. This intermediary approach allows efficient data transfer while reducing the direct thermal coupling that would otherwise be required by traditional parallel interconnection methods.
2Object-generated harmful factors
If frequency multiplexed signals are transmitted from superconducting domain to higher temperature domain, then thermal conductivity is reduced by using fewer metallic interconnections, but signal transmission complexity increases
Solution Approach 1:
The patent replaces the mechanical/approach of using multiple physical interconnections with an electromagnetic field-based frequency multiplexing system. Instead of transmitting multiple signals through multiple metallic pathways (mechanical approach), the system modulates multiple data channels onto a single electromagnetic carrier, reducing thermal conductivity while managing complexity through signal processing.
3Productivity
If hybrid systems are used to achieve high-density memory, then memory performance is improved, but thermal impact on superconducting domain increases
Solution Approach 1:
The patent segments the data transmission into frequency-multiplexed channels that can be transmitted through a minimized interconnection interface. This segmentation allows high memory performance to be achieved while the reduced physical footprint of the interface minimizes thermal impact on the superconducting domain.
Solution Approach 2:
The patent transitions from a spatial dimension approach (multiple physical interconnections) to a frequency dimension approach (multiple channels on single interconnection). This dimensional change allows high memory performance without proportionally increasing the thermal conductive path length or cross-section.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables effective communication and reduces thermal impact on the superconducting domain, enhancing the performance of hybrid computing systems by minimizing thermal conductivity and maintaining low temperatures.
Implementation Method 1
The oscillator stage comprises a direct current superconducting quantum interference device (DC SQUID)
Implementation Method 2
Superconducting computers use circuit elements made from superconductors, which are materials that conduct electrical current without resistance when cooled to sufficiently low temperatures
Data Source
AI summary
A circuit configured to transmit frequency multiplexed signals from a superconducting domain to a higher temperature domain. The circuit comprising a multiplexed signal output and a plurality of superconducting oscillator circuits each configured to output a different carrier frequency, each superconducting oscillator circuit comprising an oscillator output connected to the multiplexed signal output. Each superconducting oscillator circuit comprising a converter stage configured to convert an input of a superconducting logic signal to a Single Flux Quantum (SFQ) bit value, a splitter stage electrically connected to an output of the converter stage, the splitter stage configured to change between a first current state and a second current state based at least in part on the SFQ bit value, and an oscillator stage magnetically coupled to an output of the splitter stage and electrically coupled to the oscillator output. The oscillator stage comprising a direct current superconducting quantum interference device (DC SQUID).