Superconducting Via Structure for Coherent Quantum Signal Routing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional through-silicon vias are not suitable for quantum integrated circuits due to their non-superconducting materials, which are prone to magnetic inclusions, poor chemical resistance, and high thermal expansion, leading to decoherence and radio-frequency losses, and disrupt the fabrication of sensitive quantum circuit elements like Josephson junctions.
Innovation Solution
The development of superconducting vias with a closed membrane structure that includes a layer of superconducting material extending through the substrate, providing a continuous electrical pathway and minimizing interference, while being robust to chemical processing and temperature changes, allowing for precise fabrication of quantum circuit elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional through-silicon vias are used, then electrical signals can be routed through the substrate, but magnetic inclusions and poor chemical resistance lead to decoherence and radio-frequency losses
Solution Approach 1:
The patent changes the material parameter from conventional copper to superconducting materials (niobium, aluminum, or their alloys), which fundamentally alters the electrical and magnetic properties to eliminate magnetic inclusions and improve chemical resistance, directly resolving the reliability issue
Solution Approach 2:
The patent employs composite via structures combining superconducting materials with specific substrates and encapsulation layers, creating a multi-material system that provides both superconductivity for signal routing and protection against harmful environmental factors
2Manufacturing precision
If conventional through-silicon vias are used, then electrical signals can be routed through the substrate, but high thermal expansion disrupts the fabrication of sensitive quantum circuit elements
Solution Approach 1:
The patent selects superconducting materials with thermal expansion coefficients matched to the substrate (particularly silicon), changing the thermal parameter to minimize expansion mismatches during fabrication and operation, thereby improving manufacturing precision
Solution Approach 2:
The patent explicitly addresses thermal expansion by selecting materials with compatible thermal properties and designing the via structure to accommodate thermal cycles, ensuring that sensitive quantum circuit elements like Josephson junctions are not disrupted during fabrication
3Productivity
If superconducting material layers are deposited to create continuous electrical pathways, then signal delivery efficiency improves, but fabrication process complexity increases
Solution Approach 1:
The patent performs preliminary actions by depositing superconducting material layers and forming via structures before fabricating the sensitive quantum circuit elements, ensuring that the electrical pathways are ready and stable before the delicate circuit fabrication begins
Solution Approach 2:
The patent uses intermediary materials and processes, such as etch-stop layers and encapsulation layers, that facilitate the deposition and integration of superconducting materials while protecting the underlying substrate and enabling subsequent fabrication steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The superconducting vias enable efficient signal delivery and isolation between quantum circuit elements, support high-frequency operations, and facilitate 3D integration of quantum circuits by reducing electromagnetic interference and maintaining coherence, while being compatible with cryogenic environments.
Implementation Method 1
a layer formed of superconducting material... providing a continuous electrical pathway
Implementation Method 2
The superconducting vias enable efficient signal delivery and isolation between quantum circuit elements... reducing electromagnetic interference
Data Source
AI summary
In a general aspect, a superconducting via for routing electrical signals through a substrate includes the substrate and a layer formed of superconducting material. The substrate has a first orifice disposed on a first surface and a second orifice disposed on a second surface. A cavity extends through the substrate from the first orifice to the second orifice. The layer of superconducting material includes a first portion occluding the first orifice and having an exterior surface facing outward from the substrate. The layer also includes a second portion in contact with a side wall of the cavity an extending to the second orifice. A quantum circuit element may optionally be disposed on the first surface and electrically coupled to the exterior surface of the first portion of the layer.