Substrate processing apparatus, semiconductor manufacturing equipment, and substrate processing method
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Solution Overview
Problem
Existing substrate processing methods using supercritical fluid face challenges in reducing particle generation and photoresist loss due to surface tension and rotation, necessitating an economical manufacturing method with high yield.
Innovation Solution
A substrate processing apparatus and method utilizing a controlled supply and discharge of supercritical fluid at varying temperatures and pressures, with a blocking plate to prevent direct spraying, and a cycle of pressurizing and depressurizing the processing chamber to minimize particle generation and photoresist loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If supercritical fluid is directly sprayed onto the substrate, then the surface tension is remarkably reduced, but particles are generated and photoresist is damaged
Solution Approach 1:
The supercritical fluid supply is divided into multiple stages with different temperatures. The first supply device provides supercritical fluid at a lower temperature range, and the second supply device provides supercritical fluid at a higher temperature range, segmenting the single spraying action into sequential multi-temperature treatment stages to reduce particle generation while maintaining surface tension reduction benefits
Solution Approach 2:
The blocking plate is positioned below the substrate support to prevent direct spraying of supercritical fluid onto the substrate before the fluid can cause harm. This preliminary protective action blocks the harmful direct spray path while allowing the supercritical fluid to still achieve surface tension reduction through alternative contact methods
2Device complexity
If a single temperature supercritical fluid supply is used, then the process is simple, but particle generation and photoresist loss occur
Solution Approach 1:
The system changes the temperature parameter of the supercritical fluid by using two distinct supply devices operating at different temperature ranges. This parameter variation allows the process to achieve better results in reducing particle generation and photoresist loss while maintaining reasonable system complexity through automated control
3Ease of manufacture
If supercritical fluid is supplied without temperature variation, then the manufacturing cost is low, but yield is reduced due to particle generation
Solution Approach 1:
The control device manages periodic operation cycles where the first supply device and second supply device are activated in sequence. This periodic multi-temperature supply pattern improves manufacturing yield by reducing particle generation and photoresist loss, while the automated cycling maintains cost-effectiveness compared to continuous single-temperature operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly reduces particle generation and photoresist loss, ensuring high yield and economical manufacturing by effectively using supercritical fluid to form fine patterns on substrates.
Implementation Method 1
Due to pattern destruction caused by surface tension or rotation, a process using supercritical fluid is suggested. When supercritical fluid is used, the surface tension may be remarkably reduced.
Implementation Method 2
a cycle of pressurizing and depressurizing the processing chamber to minimize particle generation and photoresist loss
Data Source
AI summary
A substrate processing apparatus includes a processing chamber providing a processing space for processing a substrate and processing a substrate, a substrate support configured to support the substrate, a blocking plate below the substrate support and configured to prevent supercritical fluid from being directly sprayed onto the substrate, a first supply device configured to supply supercritical fluid under a first condition to the processing chamber, a second supply device configured to supply supercritical fluid under a second condition at a higher temperature than that of supercritical fluid under the first condition to the processing chamber, a discharge device configured to discharge supercritical fluid from the processing chamber, and a control device configured to control operations of the first supply device, the second supply device, and the discharge device. The control device is configured to direct the first supply device to supply supercritical fluid prior to the second supply device.