Imprint Tool Superstrate Registration Using Tapered Edge Measurement
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge in nano-fabrication is achieving precise registration of a superstrate to a substrate with irregular height variations, which affects the ability to add further layers and impacts the quality of semiconductor devices.
Innovation Solution
A method and system for measuring a tapered edge on a plate using a flexible ring portion of a chuck assembly to control atmospheric pressure, allowing the plate to form a convex and concave surface, and identifying transition points to align the superstrate accurately with the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a superstrate is placed on a substrate with height variation for nanoimprint lithography, then pattern transfer can be performed, but registration precision deteriorates due to surface topography variations
Solution Approach 1:
The system performs preliminary measurement of the substrate surface topography using a sensor before the imprint process. This allows the system to identify height variations and adjust the superstrate positioning in advance, compensating for surface irregularities before pattern transfer begins, thereby maintaining registration precision despite topography variations
Solution Approach 2:
The system changes the positioning parameters of the superstrate based on measured substrate topography. By adjusting the superstrate's position and orientation parameters according to the substrate's surface profile, the system compensates for height variations and maintains precise registration during nanoimprint lithography
2Productivity
If multiple layers are added to a substrate to increase circuits per unit area, then productivity improves, but manufacturing precision deteriorates due to increasing height variation
Solution Approach 1:
Before adding each new layer, the system performs preliminary measurement of the accumulated height variation on the multi-layer substrate. This allows the system to plan and adjust subsequent layer placement and superstrate positioning in advance, preventing height variation from compromising manufacturing precision as circuit density increases
Solution Approach 2:
The system uses a sensor to continuously measure the substrate surface profile and provides feedback to the control system. This feedback loop allows real-time monitoring of height variation across multiple layers and enables dynamic adjustment of positioning parameters to maintain manufacturing precision throughout the multi-layer fabrication process
3Reliability
If the superstrate is held rigidly for stable positioning, then reliability improves, but adaptability deteriorates due to inability to compensate for surface variations
Solution Approach 1:
The system transitions from rigid static positioning to dynamic adaptive positioning. The superstrate positioning system can adjust its configuration in real-time based on measured substrate topography, allowing it to maintain stable positioning while adapting to surface variations through controlled movement and repositioning
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the registration process by improving alignment accuracy, enabling better planarization and feature transfer, thereby improving the quality and yield of semiconductor devices.
Implementation Method 1
applying a negative vacuum pressure to a central portion of the back surface of the plate to bow the central portion of the plate such that the back surface of the plate forms a convex surface and a front surface of the plate forms a concave surface
Data Source
AI summary
Some devices, systems, and methods hold a periphery of a back surface of a plate with a flexible ring portion of a chuck assembly; apply a negative vacuum pressure to a central portion of the back surface of the plate to bow the central portion of the plate such that the back surface of the plate forms a convex surface and a front surface of the plate forms a concave surface; measure, at or near the periphery of the plate, distances between the plate and a reference location; and identify a location of a transition point of a tapered edge of the plate based on the measured distances.