Surface Light Source with Continuous Encapsulation Layer

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Solution Overview

Problem

Traditional LED backlight systems require a large light mixing distance, resulting in a thick display module due to the arrangement of LED lamp beads, which limits the compactness and efficiency of the backlight.

Innovation Solution

A surface light source comprising a substrate with light emitting diode dies arranged in an array, a driving circuit to control each diode independently, and a continuous encapsulation layer, which reduces light mixing distance and allows for dynamic light emission, integrated with a reflective layer to enhance light utilization.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If traditional LED lamp beads with independent lenses are used for secondary light distribution, then light mixing can be realized, but the display module thickness increases

Engineering Contradiction:
Improvelight mixing efficiencyVSAvoiddisplay module thickness
Core Design Contradiction:
Illumination intensityVSLength of stationary object

Solution Approach 1:

The patent divides the backlight system into multiple independent LED dies arranged in an array, with each die controlled separately by the driving circuit. This segmentation allows for precise control of light emission from different positions, achieving effective light mixing without requiring a large light mixing distance, thus reducing the overall module thickness.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The driving circuit dynamically controls at least two LED dies to emit light independently with adjustable timing and intensity. This dynamic control enables the system to optimize light mixing efficiency while maintaining a compact structure, as the light emission can be coordinated to achieve uniform illumination without increasing thickness.

Inventive Principle:
Principle #15Dynamics

2Ease of operation

If multiple independent LED lamp beads with lenses are arranged on a circuit board, then light distribution can be achieved, but the device complexity increases

Engineering Contradiction:
Improvelight distribution controlVSAvoidbacklight structure complexity
Core Design Contradiction:
Ease of operationVSDevice complexity

Solution Approach 1:

The patent integrates multiple LED dies directly onto a substrate without requiring separate lens components for each die. The driving circuit on the substrate controls all LED dies, merging the light distribution function into a single integrated system rather than using multiple independent lamp bead assemblies, thereby reducing structural complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The driving circuit serves multiple functions: it controls the emission timing of individual LED dies, adjusts light intensity, and achieves light mixing all through a single integrated circuit on the substrate. This multi-functionality eliminates the need for separate control mechanisms for each LED lamp bead, simplifying the overall device structure.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Reliability

If a continuous encapsulation layer covers all LED dies, then protection and integration are improved, but manufacturing precision requirements increase

Engineering Contradiction:
ImproveLED die protectionVSAvoidencapsulation layer alignment
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The substrate is prepared with a continuous encapsulation layer formed before the LED dies are mounted. This preliminary formation of the encapsulation layer provides a pre-established protective structure that simplifies the subsequent assembly process, as the layer is already in place to protect all LED dies uniformly without requiring precise alignment during assembly.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution reduces the overall thickness of the display module while enabling efficient light mixing and dynamic control of light emission, improving the compactness and image quality of liquid crystal display devices.

Implementation Method 1

a plurality of light emitting diode dies arranged in an array along a row direction and a column direction on the substrate

Methodology Applied
Scientific EffectLight emitting diode: Light Emitting Diode

Implementation Method 2

the driving circuit being configured to control at least two of the plurality of light emitting diode dies to emit light independently of each other

Methodology Applied
Scientific EffectElectroluminescence: Electroluminescence

Implementation Method 3

the surface light source further comprises: a reflective layer on a side of the plurality of light emitting diode dies facing the substrate, so that light emitted by the plurality of light emitting diode dies exits to the side of the plurality of light emitting diode dies away from the substrate

Methodology Applied
Scientific EffectReflection: Reflection

Data Source

PatentUS11454845B2Surface light source, manufacturing method thereof and liquid crystal display device
Publication Date: 2022.09.27 BEIJING BOE DISPLAY TECH CO LTD
  • US11454845B2 patent drawing
  • US11454845B2 patent drawing
  • US11454845B2 patent drawing

AI summary

A surface light source and a manufacturing method thereof and a liquid crystal display device. The surface light source includes a substrate; a plurality of light emitting diode dies arranged in an array along a row direction and a column direction on the substrate; a driving circuit on the substrate and electrically connected to the plurality of light emitting diode dies and the driving circuit being configured to control at least two of the plurality of light emitting diode dies to emit light independently of each other; and an encapsulation layer on a side of the plurality of light emitting diode dies away from the substrate. The encapsulation layer is a continuous film layer covering the plurality of light emitting diode dies.