Surface Mount Die Package Double-Sided Cooling
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Solution Overview
Problem
High power semiconductor dies face limitations in heat dissipation due to wire bonds interfering with top-side cooling, restricting full power testing and efficient power dissipation.
Innovation Solution
A surface mount component design where a power semiconductor die is sandwiched between upper and lower heat conducting laminate structures, allowing for double-sided cooling by electrically and thermally coupling the die to both laminate structures, enabling full power testing and efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonds are used to connect die terminals to substrate conductors, then electrical connection is achieved, but top-side cooling is interfered with and power dissipation is limited
Solution Approach 1:
The patent removes wire bonds from the package structure entirely. Instead, it uses a heat conducting laminate with embedded conductors that provide both electrical connection and thermal management functions, eliminating the harmful wire bonds that blocked cooling paths
Solution Approach 2:
The heat conducting laminate serves multiple functions simultaneously: it provides electrical connection through embedded conductors, thermal conduction through heat conducting paths, and mechanical support. This multi-functional design replaces the separate wire bond and heatsink structures
2Reliability
If wire bonds are used for terminal connection, then electrical coupling is established, but full power testing capability is lost
Solution Approach 1:
The patent removes wire bonds that prevented full power testing. The exposed pad configuration and heat conducting laminate allow test fixtures to make direct thermal and electrical contact with the die, enabling full power testing before final assembly
Solution Approach 2:
The die is electrically coupled to the heat conducting laminate before final package assembly, allowing full power testing to be performed on the die package itself prior to installation in the electronic assembly, ensuring quality without requiring separate testing steps
3Ease of manufacture
If single-sided cooling is used, then manufacturing is simpler, but heat dissipation efficiency is reduced
Solution Approach 1:
The patent divides the cooling function into two separate cooling paths: one through the heat conducting laminate from the top surface, and another through the substrate from the bottom surface. This segmentation allows heat to be dissipated simultaneously from both sides of the die, doubling the effective cooling capacity
Solution Approach 2:
The patent transitions from single-sided (one-dimensional) cooling to double-sided (two-dimensional) cooling by adding thermal conduction paths from both the top and bottom surfaces of the die, effectively utilizing both surfaces for heat dissipation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation and allows for full power testing of the semiconductor die, improving its operational performance by effectively managing thermal coupling through both top and bottom sides.
Implementation Method 1
the die is thermally coupled to the upper heatsink through the upper heat conducting laminate structure, and to the lower heatsink through the substrate and the lower heat conducting laminate structure
Implementation Method 2
configured for double-sided cooling... the die package is installed in an electronic assembly including a substrate and upper and lower heatsinks
Implementation Method 3
upper heatsink 12... lower heatsink 18... thermally coupled to upper heatsink 12... thermally coupled to lower heatsink 18
Data Source
AI summary
A power semiconductor die is sandwiched between upper and lower heat conducting laminate structures to form a surface mount component that is configured for double-sided cooling. The upper heat conducting laminate structure electrically couples top-side die terminal(s) to conductors formed on the inboard face of the lower heat conducting laminate structure, and all of the die terminals are electrically coupled to conductors formed on the outboard face of the lower heat conducting laminate structure. The die package can be placed in a test fixture for full power testing, and when installed in an electronic assembly including a circuit board and upper and lower heatsinks, the die is thermally coupled to the upper heatsink through the upper heat conducting laminate structure, and to the lower heatsink through the circuit board and the lower heat conducting laminate structure.