Surface Mounted Electronic Component with Bent Frame Terminals
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Solution Overview
Problem
Ceramic electronic components face challenges in durability and reliability under heat and mechanical stress due to limitations in current designs that fail to effectively absorb mechanical stress and manage heat distribution.
Innovation Solution
A surface-mounted electronic component design featuring frame terminals with bent portions that absorb mechanical stress, distribute heat, and connect ceramic components with conductive adhesives, ensuring reliable electrical connections and reduced acoustic noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional ceramic electronic components are used, then the component structure is simple, but the durability and reliability under heat and mechanical stress are insufficient
Solution Approach 1:
The electronic component is divided into multiple functional layers: ceramic body with internal electrodes, conductive adhesive layer, and frame terminal structure. This segmentation allows each layer to specialize in specific functions (electrical connection, stress absorption, heat dissipation), improving overall reliability without excessive complexity
Solution Approach 2:
The component uses composite material structure combining ceramic material for the body, conductive adhesive for connection, and metal frame terminal for structural support and heat dissipation. This composite approach leverages the advantages of each material to enhance durability and reliability under stress
2Reliability
If frame terminals with bent portions are added to absorb mechanical stress, then reliability improves, but device complexity increases
Solution Approach 1:
The frame terminal includes bent portions that can dynamically deform to absorb mechanical stress. This dynamic structure allows the terminal to flex and accommodate stress rather than remaining rigid, improving reliability while maintaining a relatively simple overall structure
Solution Approach 2:
The frame terminal structure is designed with specific geometric parameters (bent portions at predetermined positions) that enable stress absorption. By optimizing these structural parameters, the terminal achieves effective mechanical stress absorption without excessive complexity
3Reliability
If conductive adhesive is used to connect external electrodes to frame terminals, then electrical connection reliability improves, but manufacturing complexity increases
Solution Approach 1:
Conductive adhesive is introduced as an intermediary material between the external electrodes and frame terminals. This intermediary provides reliable electrical connection and stress distribution, improving connection reliability while using a well-established manufacturing technique
4Area of stationary object
If multiple electronic components are stacked vertically, then mounting area is reduced, but heat dissipation becomes more difficult
Solution Approach 1:
The component design utilizes vertical stacking in the third dimension to reduce the horizontal mounting area. Multiple electronic components are arranged in layers, allowing compact three-dimensional packaging while maintaining electrical functionality
5Device complexity
If internal electrodes extend to ceramic body surfaces, then electrical connection is simplified, but mechanical strength of ceramic body decreases
Solution Approach 1:
The internal electrodes are designed to extend to predetermined positions on the ceramic body surfaces before final assembly. This preliminary configuration simplifies the electrical connection structure by reducing the need for additional external electrodes, while the ceramic body maintains sufficient strength through proper electrode placement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances durability and reliability by absorbing mechanical stress, reducing heat concentration, and minimizing acoustic noise, while maintaining a compact mounting area and uniform current supply to ceramic components.
Implementation Method 1
The external electrodes of the first and second electronic components may be electrically connected to the first or second upper surface frame through a conductive adhesive
Implementation Method 2
frame terminals with bent portions that absorb mechanical stress
Implementation Method 3
distribute heat
Data Source
AI summary
A surface mounted electronic component includes a first frame terminal including a first end surface frame extending in a first direction and first upper and lower surface frames extending from upper and lower ends of the first end surface frame in a second direction; a second frame terminal including a second end surface frame opposing the first end surface frame and extending in the first direction and second upper and lower surface frames extending from upper and lower ends of the second end surface frame in a third direction opposite to the second direction; a first electronic component disposed between the first and second end surface frames below the first and second upper surface frames; and a second electronic component disposed on the first and second upper surface frames.