Surface Treatment Composition for Fast-Dissolving Water-Repellent Films
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing surface treatment agents using silylation agents and nitrogen-containing heterocyclic compounds without silicon atoms face issues with slow dissolution and inadequate water repellency, leading to pattern collapse during the manufacturing of semiconductor devices due to surface tension stresses during the drying process.
Innovation Solution
A surface treatment agent comprising silicon compounds, nitrogen-containing heterocyclic compounds, and an organic solvent, specifically formulated to improve water repellency by incorporating silicon compounds represented by general formulas [1] and [2], and silicon compounds represented by general formulas [5] and [6], which enhance the water repellency of the protective film formed on the workpiece.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a surface treatment liquid containing a silylation agent and a nitrogen-containing heterocyclic compound with no silicon atom is used, then water repellency is imparted to the workpiece, but it takes time to dissolve the raw materials and the water repellency effect is insufficient
Solution Approach 1:
The patent changes the chemical structure parameters of the silylation agent by introducing specific silicon compounds with formulas [1] and [2] that contain nitrogen-containing heterocyclic groups. This structural modification enables both rapid dissolution and sufficient water repellency, resolving the contradiction between dissolution speed and effectiveness.
Solution Approach 2:
The patent creates a composite surface treatment liquid containing multiple components: silylation agents with specific silicon compounds, nitrogen-containing heterocyclic compounds, and organic solvents. This composite formulation achieves synergistic effects that simultaneously provide rapid dissolution and robust water repellency.
2Ease of manufacture
If cleaning liquid is removed during drying step, then cleaning is completed, but surface tension stress causes pattern collapse
Solution Approach 1:
The patent applies preliminary surface treatment with the silylation agent before the drying step. This preliminary action creates a water-repellent protective film on the workpiece surface that counteracts the surface tension stress during subsequent drying, preventing pattern collapse while maintaining cleaning effectiveness.
Solution Approach 2:
The silylation treatment provides beforehand cushioning by forming a protective layer that absorbs and distributes the surface tension stress during drying, preventing direct stress transmission to the delicate patterns and avoiding collapse.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents pattern collapse by ensuring rapid dissolution of raw materials and providing a robust water repellency effect, maintaining the integrity of semiconductor device patterns during processing.
Implementation Method 1
performing surface treatment on the workpiece (that is, the pattern on the substrate) with the use of a surface treatment liquid including a silylation reagent
Implementation Method 2
it takes time to dissolve the raw materials for preparation of the surface treatment liquid
Data Source
AI summary
Please substitute the new Abstract submitted herewith for the original Abstract: The present disclosure provides a surface treatment agent capable of not only being prepared by dissolving raw materials in a short time but also exerting a good water repellency imparting effect, and a method for manufacturing a surface treated body with the use of the surface treatment agent. The surface treatment agent according to the present disclosure includes the following components: (I) at least one kind selected from the group consisting of silicon compounds represented by the following formulas (1) and (2); (II) at least one kind selected from the group consisting of a nitrogen-containing heterocyclic compound represented by the following general formula (3), a nitrogen-containing heterocyclic compound represented by the following general formula (4) and imidazole; (III) an organic solvent; and (IV) at least one kind selected from the group consisting of silicon compounds represented by the following formulas (5) and (6).