Swinging Application Device for Uniform Semiconductor Coating
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Solution Overview
Problem
In semiconductor device manufacturing, variations in application effects occur due to differing distances and angles of incidence of the application substance on processing objects, leading to inconsistent characteristics among objects.
Innovation Solution
A method involving the use of multiple trays and an application device that swings and moves to apply the substance uniformly, with interchange and reversal steps to adjust positions and orientations of processing objects between application cycles, ensuring consistent application across all objects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If processing objects are arranged in multiple rows and fed continuously below the application device, then processing efficiency is improved, but variations in application effect occur due to different distances and angles of incidence
Solution Approach 1:
The application device is made movable in the width direction through a swinging mechanism, allowing it to dynamically adjust its position and maintain a constant distance from processing objects at different locations. This dynamic positioning resolves the contradiction by enabling continuous high-speed processing while maintaining uniform application effects across all processing objects regardless of their position in the multiple rows.
2Productivity
If the application device emits substance to multiple processing objects simultaneously, then productivity increases, but the angle of incidence varies causing inconsistent application characteristics
Solution Approach 1:
The swinging mechanism enables the application device to locally adapt its position for each processing object it services. By dynamically adjusting the emission location in the width direction, the device maintains optimal incidence angles and distances for each local position, ensuring consistent application characteristics across all processing objects while maintaining high throughput.
Data Source
AI summary
A semiconductor device manufacturing method according to the present invention includes a step of arranging a plurality of processing objects on a first tray and a second tray adjacent to the first tray, a plurality of application steps in which application of an application substance to the plurality of processing objects is repeated a certain number of times by emitting the application substance from an application device formed right above a contact position at which the first tray and the second tray contact each other, by swinging the application device along a first direction across the contact position, and by moving the first tray and the second tray in a second direction perpendicular to the first direction, and an interchange step of interchanging the first tray and the second tray in position without changing the directions of the first tray and the second tray corresponding to the second direction, the interchange step being executed at least one time among the plurality of application steps.