High-Frequency Switch Module Layout for Ground Path Isolation

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Solution Overview

Problem

High-frequency switch modules suffer from deterioration of high-frequency characteristics due to leakage of high-power signals and noise from the control circuit to the transmission path through a common ground electrode, leading to harmonic wave distortion.

Innovation Solution

A high-frequency switch module design with a multilayer substrate featuring separate ground electrodes for the high-frequency and control circuits, along with insulated wiring electrodes that prevent direct interference, ensuring the control circuit ground terminal is connected directly to the substrate without unnecessary wiring, and low pass filters are placed between distinct ground electrodes to reduce signal leakage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a common ground electrode is used for both control circuit and high-frequency signal, then device complexity is reduced, but high-frequency characteristics deteriorate due to signal leakage and noise interference

Engineering Contradiction:
Improveground electrode configurationVSAvoidhigh-frequency characteristics
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The ground electrode is segmented into a first ground electrode connected to the control circuit and a second ground electrode connected to the high-frequency signal path. These separate ground electrodes prevent mutual interference by providing isolated reference potentials for each circuit type, thereby maintaining high-frequency characteristics while managing device complexity through structured separation.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A third ground electrode is introduced as an intermediary element positioned between the first and second ground electrodes. This intermediate ground electrode acts as a shielding barrier that blocks electromagnetic coupling between the control circuit ground and high-frequency signal ground, preventing signal leakage and noise interference while maintaining overall system integrity.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If control signal lines are arranged between ground electrodes, then direct interference with transmission/reception lines is reduced, but high-power signals still leak to logic circuit through common ground electrode

Engineering Contradiction:
Improvedirect interference between control signal lines and transmission/reception linesVSAvoidhigh-power signal leakage to logic circuit
Core Design Contradiction:
Object-affected harmful factorsVSObject-generated harmful factors

Solution Approach 1:

The ground system is segmented into distinct first and second ground electrodes, with the third ground electrode creating additional isolation zones. This segmentation prevents high-power signals from the high-frequency path from coupling into the control circuit ground, thereby eliminating signal leakage to the logic circuit while maintaining the beneficial arrangement of control signal lines between ground electrodes.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The third ground electrode serves as an intermediary shielding structure that blocks the path of high-power signal leakage from the second ground electrode to the first ground electrode. This intermediate barrier effectively prevents harmful electromagnetic coupling while allowing the control signal lines to maintain their protective positioning between ground structures.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS20120075002A1High-frequency switch module
Publication Date: 2012.03.29 MURATA MFG CO LTD
  • US20120075002A1 patent drawing
  • US20120075002A1 patent drawing
  • US20120075002A1 patent drawing

AI summary

A high-frequency switch module that significantly reduces deterioration of high-frequency characteristics and improves harmonic wave distortion characteristics includes a high-frequency switch and SAW filters mounted on a multilayer substrate. Low pass filters are provided within the multilayer substrate. The terminals of the high-frequency switch are located on the bottom surface of the semiconductor substrate. The high-frequency switch includes a high-frequency circuit ground terminal and a control circuit ground terminal, the multilayer substrate includes therein a ground electrode which is electrically connected to a top surface connection electrode to which the high-frequency circuit ground terminal is connected, and a wiring electrode electrically connected to a top surface connection electrode to which the control circuit ground terminal is connected is arranged so as to be insulated from the ground electrode.