Symmetric Stacked Capacitor Assembly for High-Frequency Packaging
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Solution Overview
Problem
Existing package devices, particularly capacitors, exhibit asymmetric electrical properties at different output terminals due to structural asymmetry, limiting their application at high frequencies.
Innovation Solution
The package device incorporates a stacked structure with a symmetric capacitor configuration, where the first and second ports have substantially the same resistance, achieved by connecting the capacitor in parallel and using electrodes to balance electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional capacitor structure is used in package devices, then the device can be manufactured, but the electrical properties at different output terminals are asymmetric due to structural asymmetry, limiting application at high frequencies
Solution Approach 1:
The patent applies asymmetry principle by deliberately designing a symmetric capacitor structure where identical capacitor units are arranged symmetrically with respect to a reference axis. The first and second capacitors have the same structure and are positioned symmetrically, ensuring that electrical properties at different output terminals are substantially equal, thereby resolving the directivity problem in conventional asymmetric capacitor designs
2Reliability
If a symmetric capacitor configuration is implemented, then electrical properties at different ports become substantially the same, but the device complexity increases due to the stacked structure with multiple insulating and conductive layers
Solution Approach 1:
The patent applies segmentation principle by dividing the capacitor into multiple discrete units (first capacitor and second capacitor) that are connected in parallel. Each capacitor unit consists of separate conductive layers and insulating layers, allowing independent fabrication and assembly. This segmentation enables the symmetric configuration to achieve electrical property symmetry while maintaining manufacturing feasibility through modular construction
Solution Approach 2:
The patent applies dimensionality change by transitioning from a planar capacitor structure to a stacked three-dimensional structure with multiple insulating layers and conductive layers arranged vertically. The symmetric arrangement is achieved by positioning capacitor units at different heights and horizontal positions, utilizing the third dimension to create symmetry that would be difficult to achieve in a two-dimensional layout
Data Source
AI summary
An embodiment of the disclosure provides an electronic assembly including a stacked structure, a first integrated circuit, a first passive component, and a first electrode. The stacked structure comprises a plurality of insulating layers and a plurality of conductive layers. The first passive component is disposed between the stacked structure and the first integrated circuit. The first electrode is disposed between the stacked structure and the first passive component. The first passive component is electrically connected to the stacked structure through the first electrode.