Synchronized Power Cycle and Thermal Test Apparatus
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Solution Overview
Problem
Current power cycle tests for semiconductor devices are not synchronized with thermal cycle tests, leading to inaccurate prediction of lifetime due to separate control systems, which fail to replicate the combined thermal fatigue from self-heating and external temperature changes in actual environments.
Innovation Solution
A power cycle test apparatus and method that synchronizes power cycle tests with thermal cycle tests by using a controller to execute thermal stress through ON/OFF cycles, integrating a current source and temperature changing device to replicate the stress conditions found in real-world environments, allowing for prioritization of tests based on temperature changes and heat storage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If power cycle test and thermal cycle test are conducted separately with independent control systems, then the test system complexity is reduced and ease of operation is improved, but the accuracy of lifetime prediction deteriorates because the tests cannot replicate actual environmental conditions where both self-heating and external temperature changes occur simultaneously
Solution Approach 1:
The patent combines the power cycle test system and thermal cycle test system into a single integrated test apparatus. The controller synchronizes both tests to execute simultaneously, allowing the power semiconductor device to undergo both self-heating stress and external temperature changes concurrently, thereby accurately replicating actual operating conditions and improving lifetime prediction accuracy
Solution Approach 2:
The integrated test apparatus serves multiple functions: it can independently perform power cycle tests, independently perform thermal cycle tests, and simultaneously execute both tests in a synchronized manner. This multi-functionality provides flexibility for different testing scenarios while maintaining the capability to conduct comprehensive combined stress tests
2Measurement precision
If power cycle test is synchronized with thermal cycle test to accurately reproduce stress conditions, then the accuracy of lifetime prediction is improved, but the device complexity and control difficulty increase
Solution Approach 1:
By merging the control functions of power cycle test and thermal cycle test into a single controller, the patent reduces the number of independent control systems. The unified controller coordinates both tests through synchronized execution, managing the increased complexity through integrated control architecture rather than multiple separate systems
Solution Approach 2:
The controller acts as an intermediary that coordinates between the power source and temperature changing device. It synchronizes the execution phases of both tests by controlling the timing and sequence of operations, thereby managing the complexity of coordinated multi-parameter testing through centralized control logic
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This synchronization enables more reliable evaluation of power semiconductor devices by reproducing the stress conditions they experience in actual use environments, improving the accuracy of lifetime prediction.
Implementation Method 1
applying a thermal stress to the power semiconductor device through the application of a stress current thereto in predefined ON/OFF cycles
Implementation Method 2
temperature changing device for changing a temperature in an external environment of the power semiconductor device
Data Source
AI summary
Provided are a power cycle test apparatus and a power cycle test method that can efficiently reproduce nearly a level of stress that may occur in failure mode in actual environments, the apparatus which is a test apparatus for performing a power cycle test for a power semiconductor device to be tested by applying a thermal stress to the power semiconductor device through the application of a stress current thereto in predefined ON/OFF cycles executes a thermal cycle test in temperature rise-fall cycles longer than the ON/OFF cycles by using an apparatus configured to change an external environmental temperature and further executes the power cycle test while executing the thermal cycle test in synchronization with execution phases of the thermal cycle test.