T-Shaped Interposer Layout for Dense SiP Fan-Out Connections
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Solution Overview
Problem
Current interposers in SIP processes occupy large layout space due to limitations in pad size and spacing, affecting component placement on motherboards.
Innovation Solution
An interposer with a T-shaped structure, featuring a vertical body and horizontal branch, where the horizontal branch extends from the top of the vertical body, with smaller bottom pads connected to larger top pads via vias, allowing for reduced pad size and spacing, and a method of manufacturing this interposer using a multi-layer printed circuit board process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a symmetrical columnar interposer structure is used, then electrical connection between pads is achieved, but the layout space occupied on the motherboard increases
Solution Approach 1:
The patent applies asymmetry by designing the interposer with a T-shaped structure where the bottom pads have different dimensions and spacing compared to the top pads. Specifically, the bottom pads are arranged in a denser grid pattern with smaller individual pad sizes, while the top pads are larger and more sparsely distributed. This asymmetric design allows the interposer to occupy less layout space on the motherboard while maintaining reliable electrical connections through the via holes that penetrate through the interposer body.
Solution Approach 2:
The patent utilizes dimensionality change by transitioning from a two-dimensional symmetrical pad arrangement to a three-dimensional T-shaped structure with different pad configurations at the top and bottom surfaces. The vertical body of the T-shape provides height dimension, allowing pads to be positioned at different vertical levels and connected through vias, thereby reducing the horizontal footprint on the motherboard while preserving electrical connectivity.
2Area of stationary object
If pad size and spacing are reduced to save space, then layout space utilization improves, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies local quality by implementing different pad size and spacing characteristics at different locations of the interposer. The bottom pads are designed with smaller sizes and tighter spacing to optimize space utilization on the motherboard, while the top pads are designed with larger sizes and wider spacing to facilitate easier connection to the molding package. This localized differentiation allows each region to be optimized for its specific function while maintaining overall manufacturability.
Data Source
AI summary
An interposer and preparation method thereof, and a system-in-package structure are disclosed. The interposer comprises: a vertical body and a horizontal branch, wherein the vertical body and the horizontal branch form a T-shaped structure; the vertical body comprises a bottom copper foil layer and a first insulating layer, wherein the bottom copper foil layer is provided with several first pads; the horizontal branch comprises a blocking copper foil layer, a second insulating layer and a top copper foil layer, wherein the top copper foil layer is provided with second pads corresponding to the first pads; each first pad position is provided with a via penetrating the first insulating layer and the blocking copper foil layer, and the first pad is electrically connected to the corresponding second pad through the via. The interposer realizes a fan-out connection function, and saves the space occupied on the motherboard due to its T-shaped structure.