Tackifier-Modified Etchant for Polyimide Profile Control
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Solution Overview
Problem
Isotropic etching in semiconductor and display equipment industries often results in the undercutting phenomenon, which compromises the reliability of electronic elements and display quality due to its isotropic nature and longer processing time compared to anisotropic etching.
Innovation Solution
An etchant composition comprising a tackifier with a resin containing a hydroxyl group, a surfactant, and a first solvent, combined with an alkaline solution including an alkaline compound and a second solvent, is developed to improve viscosity and peeling capability, thereby addressing the undercutting issue by effectively removing polyimide without position limitations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If isotropic etching is used, then processing time is reduced, but undercutting phenomenon occurs between patterned film layer and adjacent film layer
Solution Approach 1:
The patent modifies the chemical composition parameters of the etchant by incorporating specific tackifiers (rosin derivatives, colophony, or petroleum resin) combined with organic solvents and water. This composition adjustment changes the etching mechanism to achieve vertical sidewalls while maintaining fast processing speed, resolving the contradiction between speed and precision
Solution Approach 2:
The etchant is formulated as a composite solution containing multiple components: tackifier (1-50 g/L), organic solvent (5-50 mL/L), and water. This composite formulation synergistically combines the adhesion-promoting tackifier with the dissolving organic solvent to achieve both rapid etching and precise profile control without undercutting
2Productivity
If conventional etchant composition is used, then etching speed is maintained, but residue and poor peeling capability occur
Solution Approach 1:
The tackifier acts as an intermediary substance that mediates between the etchant and the polyimide film. It promotes uniform distribution and adhesion of the etchant to the film surface, enabling complete removal without residue while maintaining etching speed. The tackifier's adhesive properties ensure thorough contact and peeling capability
Solution Approach 2:
The patent optimizes concentration parameters of the etchant components: tackifier (1-50 g/L), organic solvent (5-50 mL/L), and water. These parameter adjustments ensure the etchant maintains sufficient etching speed while achieving complete residue-free removal and excellent peeling capability through proper formulation balance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The etchant composition enhances etching positioning accuracy and efficiency by removing organic substances without residue, improving the reliability and quality of electronic elements and devices, and preventing the undercutting phenomenon.
Implementation Method 1
The surfactant (b) includes at least one of a polyether surfactant containing an aryl group and a fluorine surfactant
Implementation Method 2
The alkaline compound (d) includes at least one selected from a group consisting of an alkali metal hydroxide, a carbonate compound and an amine-based hydroxide
Implementation Method 3
The etchant composition is used to remove an organic substance
Data Source
AI summary
An etchant composition, a tackifier, an alkaline solution, a method of removing polyimide and an etching process are provided. The etchant composition includes a tackifier (A) and an alkaline solution (B). The tackifier (A) includes a resin containing a hydroxyl group (a), a surfactant (b) and a first solvent (c1). The alkaline solution (B) includes an alkaline compound (d) and a second solvent (c2).