Tamper Resistant IC Using PUF in Passivation Layer

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Solution Overview

Problem

Conventional integrated circuits are unable to detect physical or chemical modifications, such as the removal of passivation layers, which can lead to unauthorized tampering and reverse engineering, compromising their security.

Innovation Solution

Incorporating a physical unclonable function (PUF) in the passivation layer using randomly distributed conducting particles, such as aluminum, which can be evaluated by a detector to identify changes and compare against a stored reference value, enabling autonomous detection of tampering attempts.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional integrated circuits are used without additional detection mechanisms, then the device complexity is low, but the ability to detect tampering is insufficient

Engineering Contradiction:
Improvetamper detection capabilityVSAvoiddevice complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The integrated circuit performs self-detection of tampering by using its own operational characteristics (power consumption, timing, signal behavior) to identify modifications. The circuit monitors itself without requiring external detection equipment, thereby improving reliability while avoiding additional complex external monitoring systems.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The patent detects tampering by measuring changes in electrical parameters such as power consumption, signal timing, and voltage levels. By monitoring these physical parameters that change when the circuit is modified, the system can identify tampering without adding complex structural elements, thus improving detection capability while maintaining relatively simple device architecture.

Inventive Principle:
Principle #35Parameter changes

2Object-affected harmful factors

If physical or chemical modification methods are used for attacks, then the ability to circumvent security measures is improved, but the detectability of attacks should be enhanced

Engineering Contradiction:
Improveattack detectabilityVSAvoidsecurity certification
Core Design Contradiction:
Object-affected harmful factorsVSReliability

Solution Approach 1:

The integrated circuit is designed with built-in monitoring capabilities that detect tampering attempts before they can successfully compromise security. By continuously monitoring electrical parameters and comparing them against expected values, the system can identify and respond to modifications (such as passivation layer removal) before unauthorized access is achieved, thereby preventing security certification compromise.

Inventive Principle:
Principle #9Preliminary anti-action

3Reliability

If autonomous detection capability is added to integrated circuits, then the tamper resistance is improved, but the manufacturing complexity increases

Engineering Contradiction:
Improvetamper resistanceVSAvoidmanufacturing ease
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent replaces complex mechanical or external monitoring systems with electrical parameter measurements that can be performed using standard integrated circuit components. By substituting physical inspection methods with electrical monitoring of power consumption, timing, and signal behavior, the system achieves autonomous tamper detection using conventional manufacturing processes and readily available components.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS9509306B2Tamper resistant IC
Publication Date: 2016.11.29 NXP BV
  • US9509306B2 patent drawing
  • US9509306B2 patent drawing
  • US9509306B2 patent drawing

AI summary

According to an aspect of the invention an integrated circuit is conceived which comprises a physical unclonable function which is at least partially implemented in a passivation layer of said integrated circuit. According to a further aspect of the invention, a corresponding method for manufacturing an integrated circuit is conceived. According to a further aspect of the invention, an electronic device is conceived which comprises an integrated circuit of the kind set forth.