Tandem Photovoltaic Structure With Integrated Encapsulation
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Solution Overview
Problem
Existing photovoltaic (PV) devices face challenges in efficiency, cost, and weight due to the need for separate transparent substrates and adhesive layers in tandem PV structures, which increase material consumption, complexity, and optical losses.
Innovation Solution
The proposed solution involves a tandem solar device architecture where the top PV cell is fabricated directly on a front transparent substrate that also serves as the top encapsulating substance, eliminating the need for a separate substrate and adhesive layer, and incorporating a Through-Substrate-Via (TSV) structure for improved interconnection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a separate transparent substrate and adhesive layer are used in tandem PV structures, then the structural integrity and bonding between cells are improved, but material costs and device complexity increase
Solution Approach 1:
The patent combines the substrate and encapsulating substance into a single integrated component. The front transparent substrate serves dual functions as both the structural substrate and the top encapsulating layer, eliminating the need for separate adhesive layers and reducing overall device complexity while maintaining structural integrity
Solution Approach 2:
The front transparent substrate is designed to perform multiple functions simultaneously: it serves as the mechanical substrate for mounting the top PV cell, acts as the top encapsulating substance for protection, and provides optical transparency for light transmission. This multi-functionality reduces the number of components needed
2Reliability
If separate substrate and adhesive layers are used, then bonding between top and bottom PV cells is improved, but material consumption and cost increase
Solution Approach 1:
The substrate and encapsulating substance are merged into one component, eliminating redundant materials. The front transparent substrate directly bonds to the top PV cell while simultaneously serving as the encapsulating layer, reducing total material consumption without compromising bonding reliability
Solution Approach 2:
The separate adhesive layer is extracted/removed from the structure. The bonding function is integrated directly into the substrate-encapsulant combination, eliminating the need for additional adhesive materials while maintaining reliable bonding between components
3Stability of the object's composition
If multiple intervening material layers are present, then structural completeness is improved, but optical efficiency decreases
Solution Approach 1:
By merging the substrate and encapsulating substance into a single layer, the number of interfaces is reduced. Fewer interfaces mean fewer opportunities for optical reflection and scattering losses, thereby improving optical efficiency while maintaining structural completeness
Solution Approach 2:
Unneeded intervening material layers are extracted/removed from the structure. The direct bonding of the top PV cell to the front transparent substrate eliminates intermediate layers that would otherwise cause optical losses, improving light transmission efficiency
4Ease of manufacture
If conventional tandem PV structure with separate layers is used, then manufacturing robustness is improved, but device weight increases
Solution Approach 1:
The substrate and encapsulating substance are combined into one component, directly reducing the total weight of the device. This weight reduction is achieved without compromising manufacturing robustness, as the integrated structure maintains structural integrity and bonding functionality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces material costs, enhances optical efficiency, and minimizes weight, thereby improving the overall performance and competitiveness of photovoltaic devices.
Implementation Method 1
Photovoltaic (PV) devices are becoming an increasingly important element of global energy production
Implementation Method 2
front transparent substrate that also serves as the top encapsulating substance
Data Source
AI summary
A photovoltaic device includes one or more features that taken alone or in combination enhance its efficiency. Some embodiments may comprise a tandem solar device in which a top PV cell is fabricated upon a front transparent substrate, that also serves as the top encapsulating substance. The top PV cell including the front encapsulating substance is then bonded (e.g., using adhesive) to a bottom PV cell in order to complete the tandem device. Using the same transparent, insulating element as both front encapsulating substance and a substrate for fabricating the top PV cell, obviates to the need to provide a separate structure (with resulting interfaces) to perform the latter role. For tandem and non-tandem PV devices, a Through-Substrate-Via (TSV) structure may extend through an insulating substrate in order to provide contact with an opposite side (e.g., back electrode). Embodiments may find particular use in fabricating shingled perovskite photovoltaic solar cells.