Tape-Attached PoP Semiconductor Packaging for Warpage Control
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Solution Overview
Problem
The increasing complexity of semiconductor packages poses challenges in manufacturing, with existing methods becoming more difficult and complex, particularly in improving warpage characteristics, leading to a need for a simplified package and manufacturing method.
Innovation Solution
The use of tape attachment and conductive vias formed through trench cutting and filling, allowing for a package-on-package (PoP) device with improved warpage characteristics and reduced manufacturing complexity, eliminating the need for a separate interposer and enabling finer interconnect pitches.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If complex manufacturing methods are used to improve warpage characteristics, then warpage control is improved, but manufacturing complexity increases
Solution Approach 1:
The patent extracts and eliminates the interposer layer from the package structure, replacing it with a tape attachment method that directly bonds the first and second packages. This removal of the interposer simplifies the manufacturing process while maintaining warpage control through the adhesive tape's compliance properties.
Solution Approach 2:
The patent changes the bonding approach from rigid interposer-based attachment to flexible tape-based attachment. The adhesive tape's material properties (compliance, thickness, adhesive characteristics) are optimized to accommodate warpage while simplifying the overall structure and manufacturing process.
2Reliability
If interposer is used to stack packages, then electrical connections are established, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The interposer is completely removed from the package stack. Electrical connections are established directly between the first and second packages through the adhesive tape, eliminating the need for the interposer and its associated manufacturing complexity.
Solution Approach 2:
The adhesive tape serves multiple functions simultaneously: it provides mechanical bonding between packages, establishes electrical connections through conductive vias, and accommodates warpage compliance. This multi-functionality replaces the interposer's roles while simplifying the overall structure.
3Reliability
If traditional attachment methods are used, then manufacturing process is established, but warpage characteristics and interconnect pitch are limited
Solution Approach 1:
The patent changes the attachment method from traditional rigid bonding to flexible tape attachment with conductive vias. This allows for finer interconnect pitches and better warpage control while maintaining ease of manufacture through the tape's compliance and simplified bonding process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, reduces costs, and enhances the reliability of electrical connections by using adhesive tape and conductive vias to stack semiconductor packages, providing improved warpage characteristics and interconnect efficiency.
Implementation Method 1
a first package is attached to a second package with an adhesive tape
Implementation Method 2
at least one conductive via extends through the adhesive tape
Data Source
AI summary
A semiconductor device has a first semiconductor package including a substrate and an encapsulant deposited over the substrate. An adhesive tape is disposed on the encapsulant. A conductive via is formed by trench cutting through the adhesive tape and encapsulant to expose the substrate. A second semiconductor package is disposed over the adhesive tape opposite the first semiconductor package. The first semiconductor package and second semiconductor package are bonded together by the adhesive tape.