Tear-proof Circuit with Cavity Break Points

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing integrated circuits in products like printer cartridges are difficult to render unusable after use, as they can be reused or counterfeited by removing and reattaching the integrated circuit, which lacks commercial interest in non-reusable products.

Innovation Solution

A flexible circuit with cavities near or under electric elements that break or distort upon substrate flexion or stretching, making the circuit unusable by creating a preferred break point, ensuring the circuit remains attached to its original support.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If the interface circuit is made reusable by allowing easy removal and reattachment, then ease of operation is improved, but product integrity and anti-counterfeiting capability deteriorate

Engineering Contradiction:
Improveease of removal and reattachmentVSAvoidproduct integrity and anti-counterfeiting
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The patent applies preliminary action by pre-positioning cavities in the flexible substrate at specific locations that will serve as preferred break points. These cavities are prepared in advance during manufacturing, positioned to align with or under conductive paths, so that when force is applied during removal, the substrate naturally breaks at these predetermined locations rather than allowing arbitrary separation. This ensures the circuit cannot be easily removed and reattached while maintaining product integrity.

Inventive Principle:
Principle #10Preliminary action

2Reliability

If cavities are added to the substrate to create preferred break points, then reliability is improved, but device complexity increases

Engineering Contradiction:
Improveanti-reuse capabilityVSAvoidsubstrate structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies local quality by introducing cavities only in specific localized areas of the flexible substrate where they are needed to create preferred break points, rather than modifying the entire substrate structure. The cavities are strategically positioned at discrete locations aligned with conductive paths, leaving the rest of the substrate intact and maintaining its flexibility and structural integrity. This localized modification achieves anti-reuse capability without unnecessarily complicating the overall device structure.

Inventive Principle:
Principle #3Local quality

3Strength

If the substrate is made more rigid to prevent breaking, then strength is improved, but flexibility deteriorates

Engineering Contradiction:
Improvesubstrate strengthVSAvoidflexibility
Core Design Contradiction:
StrengthVSAdaptability or versatility

Solution Approach 1:

The patent applies segmentation by dividing the continuous substrate structure into segments through the introduction of cavities. These cavities act as stress concentration points that segment the load distribution during bending or stretching, allowing the substrate to flex without causing unintended breaks in the conductive paths. The cavities create controlled weak points that guide the breaking process only when necessary, while maintaining overall structural strength and flexibility during normal operation.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS9226393B2Tear-proof circuit
Publication Date: 2015.12.29 STMICROELECTRONICS (ROUSSET) SAS
  • US9226393B2 patent drawing
  • US9226393B2 patent drawing
  • US9226393B2 patent drawing

AI summary

A circuit including a flexible substrate and at least one electric element attached to the substrate, the substrate including at least one cavity arranged near the electric element and helping to break or distort the electric element in response to a flexion or stretching of the substrate. Application in particular is to the manufacture of tear-proof electronic micromodules.