Temperature Adjustment Device Heat Pump Recovery
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Solution Overview
Problem
Existing temperature adjustment systems for substrates face inefficiencies due to heat loads caused by returning media of different temperatures, leading to prolonged temperature stabilization times, increased power consumption, and durability issues from heat shock.
Innovation Solution
A temperature adjustment device incorporating a heat pump to transfer heat between low and high temperature adjustment media in returning flow passages, reducing heat loads and improving temperature control efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If maximum power of heat sources in temperature adjustment units is increased to decrease temperature stabilization time, then temperature control speed is improved, but power consumption increases
Solution Approach 1:
The invention recovers heat from the returning medium that would otherwise be wasted and uses it to preheat or precool the outgoing medium. This converts the harmful heat load that causes temperature instability into a useful resource that reduces the workload of heating/cooling sources, thereby decreasing power consumption while maintaining temperature control speed
Solution Approach 2:
A heat exchanger is introduced as an intermediary component between the outgoing and returning medium flow paths. This heat exchanger facilitates heat transfer from the returning medium to the outgoing medium, enabling temperature stabilization without requiring additional power from heating/cooling sources
2Use of energy by moving object
If valve switching timings in temperature adjustment units are delayed to decrease heat loads, then power consumption is reduced, but temperature control precision deteriorates
Solution Approach 1:
The heat exchanger performs preliminary heating or cooling of the outgoing medium using the returning medium before the medium enters the temperature adjustment unit. This preliminary action reduces the temperature adjustment burden on the main heating/cooling sources, allowing for more precise temperature control with lower power consumption
3Device complexity
If tanks of high temperature and low temperature adjustment units are coupled to each other, then system complexity is reduced, but heat transfer between tanks causes durability deterioration due to heat shock
Solution Approach 1:
The invention separates the high temperature and low temperature adjustment unit tanks into independent systems, preventing direct coupling and the resulting heat shock. By segmenting the thermal systems, the patent eliminates thermal stress on components while maintaining operational efficiency through the heat exchanger-based heat recovery system
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat pump enables efficient heat transfer, reducing power consumption and maintaining controlled temperatures, thereby enhancing productivity and preventing durability deterioration from heat shock.
Implementation Method 1
A heat pump is connected to the first flow passage and the second flow passage and configured to transfer heat between the first temperature adjustment medium and the second temperature adjustment medium
Data Source
AI summary
A temperature adjustment device includes a pedestal to receive a substrate thereon, a first temperature control unit to set a first medium at a first temperature, and a second temperature control unit to set a second medium at a second temperature that is higher than the first temperature. A pedestal flow passage is provided inside the pedestal to allow the first medium and the second medium to flow therethrough by switching between the first medium and the second medium. A first flow passage through which the first medium flowing from the pedestal flow passage is allowed to flow is provided. A second flow passage through which the second medium flowing from the pedestal flow passage is allowed to flow is provided. A heat pump is connected to the first flow passage and the second flow passage to transfer heat between the first medium and the second medium.