Temperature-Controlled Module for Electronic Devices Preventing Condensation
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Solution Overview
Problem
Existing low-temperature testing methods for electronic devices face inefficiencies due to prolonged cooling times, complex testing platform designs, and the risk of moisture condensation leading to short circuits, which complicates space arrangement, shipment flow, and testing efficiency.
Innovation Solution
A temperature-controlled module comprising a tray with a fluid chamber and an upper board with through holes, combined with a dry-air supply device to rapidly cool electronic devices and prevent surface condensation, featuring a modular design for adaptable electronic-device holding cavities and a dry-air flowing space to maintain temperature and inhibit moisture condensation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the electronic device is cooled directly on the testing platform, then the temperature can be lowered to the desired level, but the testing time becomes much longer due to the necessary wait time for cooling
Solution Approach 1:
The patent implements a pre-cooling zone where electronic devices are cooled down to the desired low temperature before being transferred to the testing platform. This preliminary cooling action eliminates the need for waiting time during the actual testing process, as the devices are already at the required temperature when testing begins.
2Object-affected harmful factors
If a seal chamber or air curtain is introduced to prevent low-temperature air and injected dry air from dissipation, then moisture condensation can be inhibited, but problems arise in space arrangement, shipment flow, testing efficiency, and costing
Solution Approach 1:
The patent extracts the dry air injection function from a complex sealed chamber system and implements it through simple air outlets that directly inject dry air into the pre-cooling zone. This extraction of the essential function (moisture prevention) from the complex structure (seal chamber/air curtain) achieves the same protective effect while dramatically simplifying the overall system design and improving space utilization.
3Temperature
If the electronic device is kept in a low-temperature zone, then the temperature can be maintained, but moisture condensation on the device surface becomes inevitable due to exposure to the atmosphere
Solution Approach 1:
The patent creates a controlled atmospheric environment in the pre-cooling zone by injecting dry air, which acts as an inert atmosphere that prevents moisture condensation on the cold electronic device surfaces. This inert air environment allows the devices to be cooled and maintained at low temperatures without the harmful condensation effect that would occur in normal atmospheric conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient temperature control of electronic devices, reduces testing time, and prevents moisture condensation, thereby improving space arrangement, shipment flow, and testing efficiency while ensuring safe and uninterrupted testing.
Implementation Method 1
a fluid chamber (22) for receiving a cooling fluid (CL) is arranged inside the temperature-controlled tray (2)
Implementation Method 2
occasional condensation of moisture on the electronic device in a low-temperature environment is definitely inevitable
Data Source
AI summary
A temperature-controlled module for electronic devices and a testing apparatus provided with the same mainly include a temperature-controlled tray, an upper board and a dry-air supply device. The temperature-controlled tray includes holding cavities for accommodating electronic devices and a fluid chamber for cooling fluid. The upper board is furnished with through holes, while the upper board and the temperature-controlled tray are spaced by a predetermined distance. The dry-air supply device provides dry air to a space between the temperature-controlled tray and the upper board. Thereupon, by having cooling fluid to flow inside the temperature-controlled tray, the temperature-controlled tray can be kept in a lower predetermined temperature so as to rapidly cool down the electronic device. In addition, by providing the upper board and the dry-air supply device to allow dry air to flow through the surface of the electronic device, then the water-condensation phenomenon and air leakage can avoided.