Chemical Mechanical Polishing Pad With Temperature-Selective Groove Layers
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Solution Overview
Problem
Existing chemical mechanical polishing pads experience uneven abrasion during the polishing process, leading to inconsistent groove depths and reduced polishing efficiency due to variations in the wear of protrusions and grooves.
Innovation Solution
A chemical mechanical polishing pad design featuring alternating layers of protection and dissolution layers in the grooves, which are selectively removable by temperature-controlled aqueous solutions, allowing precise adjustment of groove depth through controlled dissolution of the protection layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If grooves are formed in the chemical mechanical polishing pad to supply slurry abrasive material, then slurry supply is improved, but groove depth becomes inconsistent due to uneven abrasion of protrusions
Solution Approach 1:
The patent applies preliminary action by pre-forming grooves with a predetermined depth in the polishing pad before the polishing process begins. This ensures that the grooves maintain consistent depth and geometry throughout the polishing operation, preventing the groove depth variation that would otherwise occur due to protrusion wear. The grooves are created through a controlled manufacturing process that establishes their dimensions in advance.
Solution Approach 2:
The patent utilizes parameter changes by controlling the geometric parameters of the grooves (depth, width, shape) during the manufacturing process. By precisely controlling these parameters when forming the grooves, the patent ensures uniform groove depth and geometry, which maintains consistent slurry supply characteristics throughout the polishing process despite the wear that occurs during use.
2Strength
If protrusions are made large to maintain structural integrity, then pad strength is improved, but friction becomes uneven as protrusions wear at different rates
Solution Approach 1:
The patent applies local quality by creating grooves with specific local geometric characteristics (depth, width, shape) that differ from the surrounding pad material. These locally optimized groove structures ensure uniform wear patterns and consistent friction characteristics across the polishing pad surface, while the overall pad structure maintains its structural integrity through the distributed groove pattern.
Solution Approach 2:
The patent uses preliminary action by pre-establishing the groove geometry and distribution pattern during manufacturing. This preliminary structuring ensures that the grooves will wear uniformly and maintain consistent friction properties throughout the polishing process, preventing the uneven abrasion that would occur with improperly designed protrusion-groove structures.
3Productivity
If groove depth is increased to improve slurry flow, then slurry supply is enhanced, but groove geometry becomes inconsistent due to wear
Solution Approach 1:
The patent applies preliminary action by pre-forming grooves with an optimized depth and geometry that is predetermined during manufacturing. This preliminary structuring ensures that the grooves maintain their geometric consistency and slurry flow characteristics throughout the polishing process, preventing the geometry inconsistency that would otherwise result from wear during operation.
Solution Approach 2:
The patent utilizes parameter changes by optimizing the groove geometric parameters (depth, width, shape) during the manufacturing process. By carefully controlling these parameters, the patent achieves the desired slurry flow rate while maintaining geometric consistency, ensuring that the grooves wear uniformly and preserve their shape throughout the polishing operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Maintains a uniform abrasion ratio and groove depth, enhancing polishing efficiency by ensuring consistent friction and preventing reduced friction due to protrusion wear, thus improving the polishing process.
Implementation Method 1
at least one dissolution layer in the groove, and at least one protection layer in the groove, where the at least one protection layer and the at least one dissolution layer are configured to be dissolved by an aqueous solution, the at least one dissolution layer is configured to be dissolved by the aqueous solution at a first temperature
Implementation Method 2
the at least one protection layer is configured to be dissolved by the aqueous solution at a second temperature that is higher than the first temperature
Data Source
AI summary
A chemical mechanical polishing pad includes a lower pad body, an upper pad body on an upper surface of the lower pad body and including a first protrusion and a second protrusion, the first protrusion and the second protrusion protruding in a first direction, a groove between the first protrusion and the second protrusion and extending in a second direction intersecting the first direction, at least one dissolution layer in the groove, and at least one protection layer in the groove, where the at least one protection layer and the at least one dissolution layer are configured to be dissolved by an aqueous solution, the at least one dissolution layer is configured to be dissolved by the aqueous solution at a first temperature, and the at least one protection layer is configured to be dissolved by the aqueous solution at a second temperature that is higher than the first temperature.