Temperature Sensor Layout for Accurate Sensing and Clean Signal Emission

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Solution Overview

Problem

Existing temperature sensors face challenges in achieving high accuracy and signal emission quality while maintaining a low cost and simple structure, primarily due to the conventional layout that keeps the temperature-sensitive element far from the sensed component and exposes the antenna to interference from metal components and the battery.

Innovation Solution

The temperature sensor design separates the temperature-sensitive element from the circuit board and locates it closer to the sensed component, with the antenna positioned away from the base and circuit board to minimize interference, using a metal base for better heat conduction and incorporating spacers and a cushion to reduce component interactions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If the temperature-sensitive element is mounted on the circuit board, then the structure is simpler and cost is lower, but the temperature sensing accuracy deteriorates due to increased distance from the sensed component

Engineering Contradiction:

Improvetemperature sensing accuracyVSAvoidstructural complexity

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

The temperature sensor is divided into separate functional modules: the temperature-sensitive element is separated from the circuit board and mounted directly on the base, while the circuit board handles only signal processing. This segmentation allows the sensing element to be positioned close to the sensed component for accurate measurement, while keeping the overall structure organized and manageable.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The base serves as an intermediary component that directly contacts both the sensed component and the temperature-sensitive element. By mounting the temperature-sensitive element on the base rather than the circuit board, the base acts as a thermal conduit that facilitates efficient heat transfer from the sensed component to the sensing element, improving measurement accuracy without requiring direct integration of the element into the circuit board.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If the antenna is positioned close to the base and circuit board, then the device structure is more compact, but the signal emission quality deteriorates due to interference from metal components and battery

Engineering Contradiction:

Improvesignal emission qualityVSAvoiddevice compactness

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The antenna is extracted from the conventional position on the circuit board and repositioned to be suspended above the base, away from interfering components. This extraction removes the antenna from the source of electromagnetic interference (metal base and battery), improving signal emission quality and wireless communication reliability, while the device remains compact through optimized spatial arrangement of other components.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The antenna positioning transitions from a two-dimensional layout on the circuit board to a three-dimensional configuration suspended above the base. By utilizing the vertical dimension and positioning the antenna at a height of 3-5mm above the base, the design creates spatial separation from interfering components without significantly increasing the device's footprint, thus maintaining compactness while improving signal quality.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Measurement precision

If more sensitive temperature-sensitive elements and higher power emission antennas are used, then the temperature sensing accuracy and signal emission quality are improved, but the cost and structural complexity increase significantly

Engineering Contradiction:

Improvetemperature sensing accuracyVSAvoidmanufacturing cost

Core Design Contradiction:

Measurement precisionVSEase of manufacture

Solution Approach 1:

The design replaces the need for highly sensitive (and expensive) temperature-sensitive elements by optimizing the thermal conduction path. The direct contact between the base, temperature-sensitive element, and sensed component creates an efficient thermal pathway that enables accurate sensing with standard, cost-effective sensing elements, eliminating the need for expensive high-sensitivity components.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances temperature sensing accuracy and signal emission quality by reducing interference and improving heat transfer, thus achieving better performance without increasing complexity or cost.

Implementation Method 1

using a metal base for better heat conduction

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS20260022975A1Temperature sensor

Publication Date: 2026.01.22 AB SKF SKF PATENT DEPARTMENT

AI summary

A temperature sensor includes a base for mounting to a part to be sensed. A temperature sensitive element is mounted to the base. A circuit board is mounted to the base. The temperature sensitive element (2) is electrically connected to the circuit board. The temperature sensor eliminates the conventional structure of mounting a temperature-sensitive element on a circuit board, but separates the temperature-sensitive element from the circuit board so as to be located as close as possible to the sensed component.