Temperature Sensor Assembly for Fast Response and Thermal Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing temperature sensor elements face challenges in achieving a short response time while maintaining mechanical stability and resistance to surrounding media, and integrating with other sensors like pressure sensors without compromising these properties.
Innovation Solution
The sensor arrangement includes a temperature sensor element mounted on a carrier with low thermal conductivity, thin electrical conductors, and a highly conductive enclosure to reduce heat input, combined with a pressure sensor, ensuring thermal separation and mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Duration of action of stationary object
If the temperature sensor element is thermally well-connected to other components for mechanical stability, then mechanical durability is improved, but response time increases due to heat input from other components
Solution Approach 1:
The patent divides the sensor assembly into thermally isolated segments: the temperature sensor element is separated from other heat-generating components through strategic thermal design, allowing each segment to function independently without thermal interference while maintaining mechanical integrity
Solution Approach 2:
The patent introduces thermally insulating materials and design features as intermediaries between the temperature sensor element and other components. These intermediaries block heat transfer paths from other components to the temperature sensor, reducing thermal interference while maintaining mechanical connections
2Reliability
If the temperature sensor element is protected by encasement material, then resistance to surrounding media is improved, but response time increases due to thermal insulation
Solution Approach 1:
The patent applies different thermal conductivity properties to different parts of the encasement: areas close to the temperature sensor use thermally insulating materials to protect from media, while areas away from the sensor allow better thermal coupling, creating localized thermal characteristics that balance protection and response time
Solution Approach 2:
The patent optimizes the thickness and thermal conductivity parameters of the encasement material to achieve the desired balance. By carefully controlling these parameters, the encasement provides adequate mechanical protection and media resistance while minimizing the thermal barrier effect on the temperature sensor response
3Strength
If electrical leads with larger cross-section are used, then mechanical strength is improved, but heat input to temperature sensor increases
Solution Approach 1:
The patent introduces thermally insulating barriers and routing designs as intermediaries between the electrical leads and the temperature sensor element. These intermediaries block the thermal conduction path from the leads to the sensor, allowing the leads to maintain their mechanical strength without transferring excessive heat to the temperature-sensitive component
4Adaptability or versatility
If the temperature sensor element is integrated with a pressure sensor, then measurement versatility is improved, but thermal interference between sensors increases
Solution Approach 1:
The patent divides the integrated sensor assembly into thermally isolated measurement zones: the temperature sensor element and pressure sensor are positioned and thermally managed as separate segments, preventing cross-thermal interference while enabling simultaneous multi-parameter measurement capabilities
Solution Approach 2:
The patent employs thermal barriers and insulating structures as intermediaries between the temperature sensor element and pressure sensor. These intermediaries prevent heat generated by the pressure sensor or its electronics from interfering with the temperature measurement, maintaining accuracy in the integrated system
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves a fast response time and mechanical durability, allowing accurate temperature measurements even in harsh environments, with the option to integrate with pressure sensors for comprehensive measurement setups.
Implementation Method 1
The sensor arrangement includes a temperature sensor element mounted on a carrier with low thermal conductivity
Implementation Method 2
a highly conductive enclosure to reduce heat input
Data Source
Figure 1
Figure 2
Figure 3
AI summary
Described is a sensor assembly comprising a temperature sensor element (13), and a method for the production of said assembly, intended to achieve short response times. The sensor assembly has connection means (14) for electrically connecting the sensor assembly (1) to an external device, electrical conductors (17) for electrically connecting the temperature sensor element (13) to the connection means (14), a support (10) for mounting the temperature sensor element (13) and the electrical conductors (17), said support having a measuring portion (24) and a covering (19) which encompasses at least the temperature sensor element (13). The electrical conductors (17) have a cross-sectional area of equal to or less than 0.08 mm2 and are directly situated on the support (10), or are on a separate conductor support (15) and situated by means of the latter on the support (10). Also described is a sensor assembly of this type, which comprises a pressure sensor as an additional sensor.