Temperature-Switching Transfer Grips for Precise Active Element Placement
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Solution Overview
Problem
The transfer of active elements with micrometric and nanometric dimensions in electronic device manufacturing is challenging due to their fragility and the limitations of current buffering matrices, which struggle with high temperature processes and accurate placement.
Innovation Solution
A method involving a transfer device with gripping portions made of materials that change state in response to temperature, allowing for deformable insertion, temporary attachment, and detachment of active elements without adhesion, enabling precise transfer and handling of fragile elements across substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If buffering matrices are used to transfer active elements, then the transfer process can be performed, but the accuracy of placement and the ability to handle micrometric/nanometric elements deteriorates
Solution Approach 1:
The patent changes the physical state of the gripping portion material through temperature control. The material transitions between a deformable state (at higher temperatures) for easy insertion and a rigid state (at lower temperatures) for precise holding and accurate placement, thereby achieving both ease of manufacture and high manufacturing precision
Solution Approach 2:
The gripping portion dynamically changes its mechanical properties (deformability) in response to temperature variations. This dynamic behavior allows the system to adapt during different stages of the transfer process: deformable during insertion for ease of manufacture, and rigid during holding for placement accuracy
2Ease of manufacture
If buffering matrices are used to transfer active elements, then the transfer can be performed, but the ability to withstand high temperatures deteriorates
Solution Approach 1:
The patent employs a material for the gripping portion that maintains its structural integrity and functional properties across a wide temperature range. The material's phase transition behavior is specifically selected to occur at temperatures compatible with high-temperature manufacturing processes, allowing the system to both withstand high temperatures and perform the transfer function
3Length of moving object
If active elements with micrometric and nanometric dimensions are handled, then the electronic device miniaturization is achieved, but the fragility and handling difficulty increases
Solution Approach 1:
The patent uses temperature-controlled phase transition of the gripping portion material to provide gentle yet secure handling of fragile active elements. The deformable state allows soft insertion that doesn't damage fragile elements, while the rigid state provides secure holding for reliable transfer, thereby maintaining handling reliability despite miniaturization
Solution Approach 2:
The gripping portion material undergoes a phase transition from deformable to rigid state, which provides a mechanism for gentle handling during insertion and secure holding during transfer. This phase transition approach is particularly suited for handling fragile micrometric and nanometric active elements without causing damage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures accurate, robust, and high-yield placement of active elements with micrometric and nanometric dimensions, compatible with high-temperature processes, reducing the risk of damage and improving manufacturing efficiency.
Implementation Method 1
the material having an ability to occupy a first state when a physical parameter associated to said material takes on a value comprised within a first range of values and a second state when the value taken on by the physical parameter is comprised within a second range of values
Implementation Method 2
adjusting said physical parameter so that the value taken on by said physical parameter is included within said first range of values to place said material in said first state
Data Source
AI summary
A method for manufacturing an electronic device including a transfer phase a a step E1 of providing a substrate towards a receiving substrate, step E2 of providing a transfer device, a step E3 including adjusting a physical parameter, a set-up step E4, a step E5 including adjusting the physical parameter so that the value of the physical parameter is included within a second range of values, a step E7 including depositing an active element in which the physical parameter allows placing the material in a first state to impart a detachment between the active element and the housing in which the active element has been inserted at step E4, step E7 being carried out so that the detachment causes setting of a portion of the active element in contact with the receiving substrate.