Template Release Coating for High-Planarity Imprint Molding
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Solution Overview
Problem
Existing planarization techniques for semiconductor substrates, such as chemical mechanical polishing (CMP) and imprint methods, face challenges in achieving high planarity and mold releasability, particularly with soft materials, leading to damage and poor productivity in mass production.
Innovation Solution
A molding apparatus and template with a planarization coating layer made of fluorine resin, such as CYTOP, are used to reduce mold releasing force and ensure high planarity, with a site front least squares range (SFQR) of 20 nm or less, enabling efficient separation and planarization of curable compositions on substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a template is used for imprint planarization, then high planarity can be achieved, but mold releasing force becomes too large causing damage and poor productivity
Solution Approach 1:
A release layer is introduced as an intermediary between the template and the curable composition. This release layer has controlled adhesion properties that allow the template to bond strongly during imprinting for high planarity, yet enable easy release afterward for high productivity. The release layer acts as a mediator that decouples the conflicting requirements of strong bonding and easy separation.
Solution Approach 2:
The template structure is made composite by combining the template substrate with a release layer having different material properties. The release layer is specifically designed with adhesion characteristics that differ from the template material, creating a composite structure that simultaneously achieves high planarity through the template and easy release through the release layer's controlled adhesion.
2Manufacturing precision
If strong adhesion between template and curable composition is used, then planarity is improved, but mold releasing force increases causing damage
Solution Approach 1:
The release layer serves as a protective intermediary that prevents direct strong adhesion between the template and curable composition. During imprinting, the release layer allows sufficient bonding for planarity while its controlled adhesion properties prevent excessive bonding forces that would cause surface damage during release.
Solution Approach 2:
The release layer provides beforehand cushioning by being pre-applied to the template with controlled adhesion properties. This cushioning effect prevents excessive bonding forces from developing during the imprinting process, thereby protecting the substrate and template surfaces from damage during subsequent release operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves high planarity and mass productivity by reducing mold releasing force, ensuring stable planarization and minimizing damage to substrates, with improved mold releasability and planarity of 20 nm or less.
Implementation Method 1
a planarization coating layer made of fluorine resin, such as CYTOP, are used to reduce mold releasing force
Implementation Method 2
cure the curable composition
Data Source
AI summary
A molding apparatus including a template apparatus is configured to bring the template into contact with a curable composition arranged on a substrate and to cure the curable composition. The template includes a planarization coating layer of which a site front least squares range (SFQR) is 20 nm or less in a contact surface which is a surface of the template in contact with the curable composition.