Tempura Coating Adhesion via Temperature and Viscosity Control
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Solution Overview
Problem
Existing methods for applying tempura coating to deep-fried snacks, particularly chicken nuggets, face issues of inadequate adhesion, complexity, and inefficiency, leading to wastage and compromised taste and texture.
Innovation Solution
A method involving mixing a tempura mix with water and ice to create a homogeneous tempura with specific temperature and viscosity, using a mixer and pump system to apply it to the snack, ensuring optimal coating adherence and quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional tempura coating methods are used, then the coating can be applied to deep-fried snacks, but the adhesion is insufficient especially on chicken nuggets
Solution Approach 1:
The patent applies parameter changes by precisely controlling the tempura batter temperature (10-14°C) and viscosity (Bostwick value 20-27 cm/30s) to optimize coating adhesion. This specific parameter control allows the coating to adhere properly to deep-fried snacks while maintaining a simplified production process
Solution Approach 2:
The patent uses preliminary action by pre-chilling the tempura batter to 10-14°C before application. This preliminary temperature control prepares the coating to adhere better to the warm deep-fried snack surface, improving adhesion without adding complex production steps
2Ease of manufacture
If traditional tempura production methods are used, then coating can be applied, but the process is complex and not cost-efficient
Solution Approach 1:
The patent optimizes the Bostwick viscosity to 20-27 cm/30s, which creates a coating consistency that is easy to apply uniformly and minimizes wastage. This parameter optimization simplifies the manufacturing process while reducing material loss
Solution Approach 2:
The tempura batter formulation and temperature control enable the coating to self-adhere properly to the snack surface during the dipping process, reducing the need for complex application equipment and minimizing wastage through efficient material utilization
3Manufacturing precision
If tempura coating is applied to deep-fried snacks, then the snack can be enhanced, but the optimal taste, consistency and quality are not guaranteed
Solution Approach 1:
The patent precisely controls the tempura batter temperature (10-14°C) and viscosity (Bostwick value 20-27 cm/30s) to ensure optimal coating quality, taste, and consistency. This parameter control guarantees reproducible results while maintaining the temperature needed for quality
Solution Approach 2:
The patent uses Bostwick viscosity measurement as a feedback mechanism to monitor and control tempura coating quality. By measuring the flow characteristics and adjusting the formulation accordingly, the process ensures consistent coating quality, taste, and texture
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method results in a crispy and airy tempura coating with excellent texture and taste, addressing the challenges of adhesion, cost-efficiency, and waste reduction.
Implementation Method 1
mixing a tempura mix with water and ice to form a homogeneous tempura using a mixer
Implementation Method 2
pumping the homogeneous tempura or part of the tempura from the mixing vessel into a batter applicator by means of a pump system
Implementation Method 3
immersing a deep-fried snack in the dipping bath, whereby the homogeneous tempura has a temperature between 10°C and 14°C after mixing
Implementation Method 4
mixing a tempura mix with water and ice to form a homogeneous tempura
Data Source
AI summary
The present invention relates to a method for making a deep-fried snack provided with a tempura coating, comprising the steps of: (a) mixing a tempura mix with water and ice to form a homogeneous tempura using a mixer in a mixing vessel, wherein the tempura mix comprises wheat flour, corn flour, starch, raising agent, herbs and spices; (b) pumping the homogeneous tempura or part of the tempura from the mixing vessel into a batter applicator by means of a pump system, wherein the tempura is collected in a dipping bath provided in the batter applicator; and (c) immersing a deep-fried snack in the dipping bath, wherein the deep-fried snack is guided through the tempura in the dipping bath by means of at least one conveyor belt, whereby the homogeneous tempura has a temperature between 10°C and 14°C after mixing, and a Bostwick viscosity value between 20 and 27 cm/30 s.