Terminal Block Resin Molding for Single-Mold Capacitor Assembly
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Solution Overview
Problem
Existing terminal block manufacturing processes require separate molding steps and two types of molding molds, leading to increased production costs and reduced productivity.
Innovation Solution
A terminal block configuration that allows for one-step molding using a single molding mold, featuring a bus bar, a conductive mounting plate body, and chip-type capacitor components bonded to both the bus bar and the mounting plate body, with a molded resin portion covering these components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If separate molding steps and two types of molding molds are used to manufacture the terminal block, then the structural integrity and positioning accuracy are improved, but the production cost increases and productivity decreases
Solution Approach 1:
The patent merges the primary molded portion and secondary molded portion into a single integrated molded resin portion that performs both functions: fixing the relative positions of the lead frame and capacitor component, and protecting the conductive bar. This consolidation eliminates the need for separate molding steps and multiple molds, directly resolving the contradiction by achieving both positioning accuracy and improved productivity through one-step molding.
Solution Approach 2:
The molded resin portion is designed to serve multiple functions simultaneously: it acts as both the primary molded portion for positioning and the secondary molded portion for protection and fixation. This multi-functional design allows a single molding operation to replace what previously required two separate molding processes, thereby maintaining manufacturing precision while significantly improving productivity.
2Strength
If separate molding steps and two types of molding molds are used to manufacture the terminal block, then the structural integrity is improved, but the production cost increases
Solution Approach 1:
The patent combines the primary and secondary molded portions into a single integrated molded resin portion that maintains all necessary structural functions. By using one molding process instead of two, the production cost is reduced while the structural integrity is preserved through the unified design that simultaneously provides positioning, protection, and fixation functions.
Solution Approach 2:
The molded resin portion is designed to perform multiple structural functions in a single component: fixing the lead frame position, protecting the conductive bar, and securing the capacitor component. This multi-functional integration reduces manufacturing complexity and cost while maintaining the structural integrity that would otherwise require multiple separate components and molding steps.
3Manufacturing precision
If two types of molding molds are used for manufacturing the terminal block, then the manufacturing precision is improved, but the device complexity increases
Solution Approach 1:
The patent merges the requirements for two different molding operations into a single molding process. The molded resin portion is designed to simultaneously achieve the positioning function of the primary molded portion and the protective/fixing function of the secondary molded portion, thereby eliminating the need for two separate molds and reducing device complexity while maintaining manufacturing precision.
Solution Approach 2:
The single molded resin portion is designed to fulfill multiple functions that previously required two separate molded portions: positioning the lead frame, protecting the conductive bar, and securing the capacitor component. This universal design allows one mold to replace two, reducing the complexity of the molding system while maintaining the precision needed for proper component positioning and protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces production costs and improves productivity by eliminating the need for separate molding steps and multiple molds, while ensuring reliable electrical connections and heat dissipation through the use of high thermal conductive resin.
Implementation Method 1
one surface and another surface of the chip-type capacitor component are bonded to the mounting plate body and the bus bar, respectively
Implementation Method 2
it is possible to omit an operation of forming the mounting hole in the molded resin portion and preparation of another component for attaching the terminal block to the electric component case. Since a plurality of mounting holes are formed in the mounting plate body, it is possible to easily attach the terminal block to the electric component case. Moreover, since the molded resin portion is made of a high thermal conductive resin, it is possible to radiate heat generated in the bus bar to outside air through the molded resin portion
Data Source
AI summary
A terminal block includes: a bus bar; a conductive mounting plate body formed with an insertion hole into which the bus bar is inserted; and a chip-type capacitor component electrically connected between the bus bar and the mounting plate body. One surface and another surface of the chip-type capacitor component are bonded to the mounting plate body and the bus bar, respectively. A molded resin portion is configured to cover at least a part of each of the bus bar, the mounting plate body, and the chip-type capacitor component, in a state in which the bus bar is inserted into the insertion hole of the mounting plate body.