Terminal Pin Surface Zoning for Low-Loss High-Frequency Packaging
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Solution Overview
Problem
Conventional semiconductor devices experience increased transmission loss of high-frequency signals due to the exposure of external connecting conductors, leading to reduced transmission characteristics and reliability.
Innovation Solution
A terminal structure comprising first and second terminal pins with varying surface roughness, where the first portion has a relatively rough surface and the second portion has a relatively fine surface, enhancing bonding strength with a sealing resin while minimizing transmission loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If fine irregularities are provided on the entire peripheral surface of the element conductor and connecting conductor to improve bonding strength with sealing resin, then reliability is improved, but transmission loss of high-frequency signals is increased
Solution Approach 1:
The patent applies local quality by providing fine irregularities only on specific portions (first and second portions) of the peripheral surface rather than the entire surface. The first portion has fine irregularities for bonding strength, while the second portion has a smooth surface for low transmission loss, allowing each region to optimize its local function.
Solution Approach 2:
The patent segments the peripheral surface into multiple portions with different surface characteristics. The first portion (with fine irregularities) and second portion (smooth) are spatially separated, allowing the bonding function and signal transmission function to be decoupled into distinct regions.
2Volume of moving object
If the distance between terminal pins is reduced to achieve miniaturization, then device size is reduced, but bonding strength with sealing resin is compromised
Solution Approach 1:
The patent concentrates fine irregularities on specific portions of the terminal pin surfaces where they can maximize bonding effectiveness. This localized approach ensures strong bonding even when the overall distance between pins is reduced for miniaturization.
Solution Approach 2:
By segmenting the surface into regions with fine irregularities and smooth regions, the patent ensures that bonding strength is concentrated at critical interfaces while maintaining compact pin spacing for device miniaturization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The terminal structure improves bonding strength and reliability while significantly reducing transmission loss, allowing for miniaturization and enhanced noise shielding and heat dissipation performance.
Implementation Method 1
At least one of the side faces includes a first portion having a relatively rough surface... the bonding strength of a sealing resin covering the plurality of first terminal pins and the plurality of second terminal pins and each terminal pin is obtained by the first portion
Implementation Method 2
The transmission characteristics of a high-frequency signal is obtained by the second portion having a relatively fine surface and having approximately the same roughness as the inside face and the outside face
Data Source
AI summary
A plurality of first terminal pins are placed side by side in a first direction. A plurality of second terminal pins are placed to extend in parallel with the plurality of first terminal pins. The plurality of first terminal pins and the plurality of second terminal pins include an inside face facing each other, an outside face opposite to the inside face, and side faces connecting the inside face and the outside face. At least one of the side faces includes a first portion having a relatively rough surface, and a second portion having a relatively fine surface and having approximately the same roughness as the inside face and the outside face.