Test Carrier Flow Passage for DUT Thermal Management

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Solution Overview

Problem

Existing electronic component testing apparatuses face challenges in efficiently cooling devices under test (DUTs) due to thermal resistance issues when using test carriers, which can lead to damage from insufficient cooling.

Innovation Solution

A test carrier with a first flow passage that allows fluid to flow through it, reducing thermal resistance by circulating air in the vicinity of the DUT, and a pusher that supplies and exhausts fluid through connection holes to enhance temperature adjustment efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If cold air is directly blown to the DUT, then cooling efficiency is improved, but the test carrier blocks the airflow causing insufficient cooling

Engineering Contradiction:

ImproveDUT temperatureVSAvoidcooling efficiency

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The test carrier is divided into multiple parts (carrier body, lid member) with flow passages integrated into specific components. The flow hole is formed in either the lid member or carrier body, creating segmented pathways for fluid flow that bypass the thermal resistance issue while maintaining structural integrity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A fluid (air or inert gas) is introduced as an intermediary medium to transfer heat away from the DUT. The fluid flows through the flow passage and directly contacts the DUT, acting as a heat transfer mediator that overcomes the thermal resistance problem of the test carrier structure.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Loss of energy

If direct air contact is used for cooling, then heat dissipation is improved, but dirt adhesion and electrification occur

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoiddirt adhesion and electrification

Core Design Contradiction:

Loss of energyVSObject-affected harmful factors

Solution Approach 1:

The patent specifies using inert gas instead of ordinary air as the cooling fluid. This creates an inert atmosphere that prevents dirt adhesion and electrification while maintaining effective heat dissipation. The inert gas flows through the flow passage and contacts the DUT, providing cooling without the harmful side effects of regular air.

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively improves the efficiency of temperature adjustment for DUTs by reducing thermal resistance and preventing damage from heat generation, while also minimizing direct air contact to prevent dirt adhesion and electrification.

Implementation Method 1

a first flow passage through which fluid supplied from an outside of the test carrier flows

Methodology Applied

Scientific EffectFluid flow:

Implementation Method 2

Fluid is supplied to the flow hole from the first connection hole and exhausted from the second connection hole

Methodology Applied

Scientific EffectHeat transfer:

Implementation Method 3

fluid may be supplied to the first flow passage from a pusher, and the pusher may press the test carrier to a socket of a test head

Methodology Applied

Scientific EffectMechanical force: Mechanical Force

Data Source

PatentUS11579187B1Test carrier and electronic component testing apparatus

Publication Date: 2023.02.14 ADVANTEST CORP

AI summary

A test carrier that accommodates a DUT and includes a first flow passage through which fluid supplied from an outside of the test carrier flows.