Test Chamber Fluid Controller for Uniform Semiconductor Burn-in
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional burn-in tests for semiconductor packages face issues with temperature uniformity and air flow distribution, leading to speed deviations and reduced test reliability due to skewed air distribution and large void spaces, which affect the accuracy and efficiency of the tests.
Innovation Solution
A test chamber with a fluid controller and a flow resistive block to ensure uniform air flow distribution and minimize void spaces, maintaining consistent temperature and flow speed across the test compartment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If hot air is supplied into the test chamber through a supply duct, then the burn-in test can be conducted, but the air distribution becomes skewed toward the bottom portion due to inertia, causing speed deviation and temperature non-uniformity
Solution Approach 1:
The supply duct is divided into multiple sections with flow control members (flow resistive blocks) positioned at different heights. These segments independently control air flow to different regions of the test chamber, compensating for the skewing effect of inertia and achieving uniform temperature distribution.
Solution Approach 2:
Flow control members are strategically positioned at specific locations within the supply duct to locally adjust air flow characteristics. The flow resistive blocks create controlled resistance at different heights, ensuring uniform air distribution throughout the test chamber rather than concentrated flow at the bottom.
2Productivity
If the void space around the SUT is large, then the test chamber can accommodate more SUTs, but the hot air flows around the SUT instead of on the SUT, reducing test efficiency and reliability
Solution Approach 1:
Flow control members act as intermediary elements between the supply duct and the SUT. These members guide and direct the hot air flow toward the SUT surface, preventing air from bypassing the SUT through large void spaces and ensuring adequate air contact for effective testing.
Solution Approach 2:
The flow control members are pre-positioned in the supply duct to shape the air flow pattern before the air reaches the SUT. This preliminary action ensures that when the air enters the test chamber, it is already directed toward the SUT, maximizing contact efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances temperature uniformity and test accuracy by controlling air flow distribution and preventing diffusion into surrounding spaces, thereby improving the reliability and efficiency of the burn-in tests.
Implementation Method 1
a fluid controller configured to uniformly control distribution of the test fluid in the supply duct and uniformly supply the test compartment with the test fluid
Implementation Method 2
a sufficiently hot or a sufficiently cold test fluid is circulated in the test chamber in such a way that the SUT sufficiently undergoes thermal stresses in the test chamber
Data Source
AI summary
Disclosed are a test chamber and a test apparatus having the same. The test chamber includes a test compartment configured to support a plurality of test boards, each being configured to secure a test object. The test chamber applies a test signal to the test object. The test chamber includes an inlet side and a discharge side, and a supply duct vertically extending along a height of the test compartment. The supply duct supplies the inlet side of the test compartment with the test fluid. The test chamber includes a fluid controller to uniformly control a distribution of a test fluid in the supply duct and uniformly supply the test compartment with the test fluid. The disclosed test chamber and test apparatus provide a uniform test temperature and thereby improve a test reliability of a test object such as a semiconductor or semiconductor package.