Direct-Docking Test Head Connection for Shorter Signal Paths
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Solution Overview
Problem
Traditional probing machines have a long signal transmission path due to the presence of a pogo tower, leading to signal interference and attenuation, and cannot switch to a direct docking mode as the load board is locked to the test head and pogo tower is locked to the machine, making it difficult for the load board to directly contact the wafer.
Innovation Solution
A method where the load board is placed on the probing machine, and the test head uses a vacuum function to align and fix it, allowing direct docking by moving the test head to touch the load board and using engaging members to secure the connection, thus eliminating the need for a pogo tower and reducing signal transmission distance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the pogo tower is used to connect the load board and wafer, then the mechanical connection is stable, but the signal transmission path becomes long causing interference and attenuation
Solution Approach 1:
The patent removes the pogo tower from the signal transmission path, extracting the problematic intermediate component that caused signal interference and attenuation. The load board is repositioned to directly contact the wafer, eliminating the pogo tower's interference while maintaining connection stability through direct docking.
Solution Approach 2:
Instead of having the load board connect to the wafer through the pogo tower (traditional approach), the patent inverts the connection architecture by placing the load board on the probing machine side and having it directly dock with the wafer, reversing the traditional signal path and eliminating the intermediate pogo tower connection.
2Adaptability or versatility
If the load board is locked to the test head and pogo tower is locked to the probing machine, then the traditional connection structure is maintained, but direct docking mode cannot be achieved
Solution Approach 1:
The patent introduces dynamic reconfigurability to the connection structure. The load board's mounting position is changed from fixed on the test head to fixed on the probing machine, and the test head's position is made adjustable. This dynamic reconfiguration enables direct docking mode while maintaining the ability to switch between different connection modes as needed.
Solution Approach 2:
The probing machine is designed with multi-functionality to accommodate both the traditional pogo tower connection mode and the new direct docking mode. The load board mounting structure on the probing machine can support both connection architectures, making the system versatile and adaptable to different testing requirements.
3Length of stationary object
If the test head is moved closer to the probing machine for direct docking, then signal transmission distance is reduced, but the load board may not reliably contact the wafer
Solution Approach 1:
The patent performs preliminary positioning actions to ensure reliable contact. The test head is pre-aligned with the wafer using alignment marks or sensors before the actual docking operation. The load board is pre-positioned on the probing machine at the optimal location, and the wafer stage is pre-adjusted to the correct height and position, ensuring that when direct docking occurs, reliable electrical contact is achieved without excessive transmission distance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables direct docking between the load board and the wafer, reducing signal interference and attenuation, and increases stability between the test head and probing machine by using the vacuum function to securely attach the load board, allowing efficient electrical connection.
Implementation Method 1
activating a vacuum function of the test head; moving the test head until touching the load board in the test fixture
Data Source
AI summary
Herein disclosed is a test head connection method, the method comprises the following steps. First, a load board and a card holder are provided between a test head and a probing machine, the card holder is disposed in the probing machine, and the card holder is used to accommodate the load board. A vacuum function of the test head is activated, and the test head is moved to align the card holder. The test head is moved to touch the load board in the card holder. At least one clamping piece is used to fix the test head and the card holder. Wherein the load board and a wafer are connected by direct probing.