Test Tray Inserts With Gradient Movement For Thermal Expansion
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Solution Overview
Problem
The existing test trays for semiconductor devices face issues with thermal expansion and contraction, leading to loose contacts and potential damage during testing at extreme temperatures, limiting the number of devices that can be processed simultaneously due to insufficient compensation of location changes in larger trays.
Innovation Solution
The test tray design incorporates a frame with inserts that have varying amounts and directions of free movement based on their location on the matrix, with larger free movement allowed for inserts further from the center, using elongated and gradient-shaped bolt penetration holes to accommodate thermal expansion and contraction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the test tray size is increased to process more semiconductor devices simultaneously, then the productivity is improved, but the thermal expansion and contraction causes larger location changes leading to loose contacts and potential damage
Solution Approach 1:
The patent applies local quality by providing different free movement ranges to different inserts based on their locations. Inserts at corners and edges (which experience greater thermal expansion) are given larger free movement ranges, while inserts at the center are given smaller ranges. This location-specific approach allows the test tray to accommodate thermal expansion effects proportionally, maintaining contact stability across the entire tray while enabling larger tray sizes for higher productivity.
2Productivity
If the test tray size is increased to process more semiconductor devices simultaneously, then the productivity is improved, but the manufacturing precision deteriorates due to insufficient compensation of location changes
Solution Approach 1:
The patent implements local quality by configuring each insert's free movement range according to its specific location on the test tray. The combination holes in the frame are designed with varying dimensions and orientations to match the thermal expansion characteristics at different locations. This ensures that each insert can move precisely the amount needed to maintain alignment with pushers and sockets, preserving manufacturing precision across the entire enlarged test tray.
3Reliability
If the free movement range is increased for inserts further from the center to compensate for thermal expansion, then the reliability is improved, but the device complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the test tray into multiple independent inserts, each with its own free movement mechanism. The frame is segmented into multiple combination holes with different configurations for different locations. This modular segmentation allows each insert to independently compensate for thermal expansion without requiring a complex centralized adjustment mechanism, thereby improving reliability while controlling overall device complexity.
Solution Approach 2:
The patent implements dynamics by allowing inserts to move freely within their designated ranges rather than being rigidly fixed. The combination holes are designed to permit controlled movement in specific directions based on thermal expansion patterns. This dynamic capability enables the structure to adapt to temperature changes automatically, improving contact stability without requiring complex active control systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures stable contact between semiconductor devices and test terminals across a wider temperature range, allowing for increased processing capacity by compensating for thermal expansion and contraction, thereby enhancing the test tray's performance under extreme temperature conditions.
Implementation Method 1
thermal expansion and contraction
Implementation Method 2
thermal expansion and contraction
Data Source
AI summary
The present invention relates to a test tray for a test handler. According to this invention, there is disclosed a technique that an insert loaded in a loading part which is arranged in a matrix pattern in a frame of the test tray allows an amount and direction of free movement thereof to be determined in accordance with a location of the loading part, where the insert is loaded, on the matrix, thereby enabling a thermal expansion or contraction of a match plate or the test tray to be compensated.