Tester I/O Port Multiplexing for Semiconductor Chip Testing

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Solution Overview

Problem

Existing semiconductor testers have a limited number of test ports, which restricts the ability to accelerate chip testing and increases manufacturing costs due to the need for more testers.

Innovation Solution

A test method where a single I/O port of a tester outputs duplicated test signals to multiple chips through a load board, with feedback signals generated by each chip being combined or averaged to determine normal operation, allowing each I/O port to test multiple chips simultaneously.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If more testers are used to accelerate chip testing, then chip production capacity is improved, but manufacturing cost increases

Engineering Contradiction:
Improvechip production capacityVSAvoidnumber of testers
Core Design Contradiction:
ProductivityVSQuantity of substance

Solution Approach 1:

The patent makes a single tester's I/O port perform multiple functions by enabling it to simultaneously test multiple chips. The tester outputs test signals to multiple chips through a load board and collects feedback signals from all chips through the same I/O port, allowing one tester to replace multiple testers and thereby increase production capacity without proportionally increasing the number of testers.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent uses a load board to duplicate test signals from a single source to multiple chips. The test signal is copied and distributed to multiple chips simultaneously, enabling parallel testing. This signal duplication approach allows one tester to effectively become multiple testers, improving productivity while controlling the quantity of testing equipment needed.

Inventive Principle:
Principle #26Copying

2Quantity of substance

If a single I/O port tests multiple chips, then the number of testers is reduced, but signal management complexity increases

Engineering Contradiction:
Improvenumber of testersVSAvoidsignal management complexity
Core Design Contradiction:
Quantity of substanceVSDevice complexity

Solution Approach 1:

The patent introduces a load board as an intermediary device between the tester and multiple chips. The load board receives the test signal from the single I/O port, distributes it to multiple chips, and collects feedback signals from all chips. This intermediary handles the complex signal routing and management, isolating the tester from the complexity while enabling one-to-many testing connections.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent segments the testing function by separating the signal distribution and collection tasks from the tester itself and placing them in the load board. The load board is divided into multiple channels, each handling a specific chip's test signal path. This segmentation allows complex signal management to be handled in a modular way, reducing the burden on the tester's I/O port while maintaining the ability to test multiple chips simultaneously.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS11988710B2Test methods, tester, load board and test system
Publication Date: 2024.05.21 CHANGXIN MEMORY TECH INC
  • US11988710B2 patent drawing
  • US11988710B2 patent drawing
  • US11988710B2 patent drawing

AI summary

The present invention provides a test method, a tester, a load board and a test system. The test method includes: outputting, through a first input/output (I/O) port of a tester, a first test signal to a first channel of a load board, wherein the first test signal is used to generate a second test signal and a third test signal; receiving, through the first I/O port, a third feedback signal returned from the first channel, wherein the third feedback signal is generated based on a first feedback signal and a second feedback signal; and determining whether a first chip and a second chip are operating normally based on the third feedback signal. Solutions provided in the present invention are capable of increasing the number of chips that can be tested at a single time.