Textured Silicon Coating for Plasma Chamber Particle Reduction
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Solution Overview
Problem
In plasma processing chambers, high stress materials such as carbon or tungsten deposited on chamber components can peel off, forming particles that contaminate substrates, leading to material deposition issues.
Innovation Solution
A chamber component with a textured surface and a silicon coating layer, having a specific range of surface roughness and purity, is used to enhance adhesion and reduce peeling, while also enabling oxygen plasma cleaning for further contamination reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a smooth surface is used for chamber components, then material adhesion is poor and peeling occurs, but a textured surface increases surface area and may lead to more particle generation
Solution Approach 1:
The patent applies a textured surface only in specific locations where material deposition occurs, rather than uniformly across the entire chamber component. This localized texturing provides enhanced adhesion where needed while minimizing overall particle generation risk. The textured surface is combined with a coating layer that further reduces peeling, creating a targeted solution that balances adhesion improvement with particle reduction.
2Strength
If a coating layer is applied to prevent peeling, then material adhesion improves, but the device complexity increases
Solution Approach 1:
The patent employs a composite structure consisting of a textured surface combined with a deposited coating layer. The coating is applied through plasma-enhanced chemical vapor deposition (PECVD) or atomic layer deposition (ALD), creating a multi-layer composite system where the textured substrate provides mechanical interlocking and the coating layer provides chemical bonding and protection. This composite approach enhances adhesion while using established deposition techniques that are already integrated into semiconductor manufacturing processes.
3Manufacturing precision
If high purity silicon coating is used to reduce contamination, then substrate quality improves, but manufacturing cost increases
Solution Approach 1:
The patent specifies a silicon layer purity range of 90-99 weight percent, allowing flexibility in selecting the optimal purity level based on substrate requirements. The thickness is controlled within 50-500 microns to balance contamination reduction with material cost. Electrical resistivity is maintained within 1E-3 to 1E3 ohm*m to ensure appropriate electrical properties. These parameter ranges enable optimization between substrate quality and manufacturing cost, allowing selection of the minimum necessary purity level for each application.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The textured silicon coating layer provides strong adhesion for materials, reduces peeling from chamber components, and protects the surface, thereby improving device yield and reducing contamination in plasma processing chambers.
Implementation Method 1
a body having a textured surface, and the textured surface has a surface roughness ranging from about 150 microinches to about 450 microinches
Implementation Method 2
a coating layer disposed on the textured surface, the coating layer comprising a silicon layer having a purity ranging from about 90 weight percent to about 99 weight percent, a thickness ranging from about 50 microns to about 500 microns
Data Source
AI summary
Embodiments generally relate to a chamber component to be used in plasma processing chambers for semiconductor or display processing. In one embodiment, a chamber component includes a textured surface having a surface roughness ranging from about 150 microinches to about 450 microinches and a coating layer disposed on the textured surface. The coating layer may be a silicon layer having a purity ranging from about 90 weight percent to about 99 weight percent, a thickness ranging from about 50 microns to about 500 microns, and an electrical resistivity ranging from about 1 E-3 ohm*m to about 1 E3 ohm*m. The coating layer provides strong adhesion for materials deposited in the plasma processing chamber, which reduces the materials peeling from the chamber component. The coating layer also enables oxygen plasma cleaning for further reducing materials deposited on the chamber component and provides the protection of the textured surface located therebelow.