Thin Film Transistor Array Panel Contact Hole Etching

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Current thin film transistor array panels face challenges in achieving a high aperture ratio due to the large size of contact holes, which hinder the development of small-sized display panels with high resolution.

Innovation Solution

The implementation of a thin film transistor array panel design that includes a reduced-sized contact hole, achieved by using an overcoat with inorganic materials like silicon nitride or silicon oxide, which allows for precise etching of the color filter and passivation layer to expose the drain electrode, enabling a pixel electrode connection with a contact hole width of 10 micrometers or less.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If the contact hole size is reduced to improve aperture ratio, then the aperture ratio is improved, but the manufacturing precision requirement increases

Engineering Contradiction:
Improveaperture ratioVSAvoidcontact hole size control
Core Design Contradiction:
Area of stationary objectVSManufacturing precision

Solution Approach 1:

The contact hole formation process is segmented into two distinct etching stages: first etching through the color filter layer, then etching through the overcoat layer. This segmentation allows each etching step to be optimized independently, with the first step creating the initial opening and the second step precisely defining the final contact hole dimensions through the overcoat mask, thereby achieving small contact holes with controlled precision

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The overcoat layer is deposited and patterned in advance before the contact hole etching process. This preliminary action creates a precise etching mask that defines the contact hole pattern, enabling subsequent etching steps to achieve the required precision for small contact holes (10 micrometers or less) without directly patterning the sensitive contact hole dimensions

Inventive Principle:
Principle #10Preliminary action

2Area of stationary object

If the contact hole size is reduced to improve aperture ratio, then the aperture ratio is improved, but the device complexity increases

Engineering Contradiction:
Improveaperture ratioVSAvoidmanufacturing process complexity
Core Design Contradiction:
Area of stationary objectVSDevice complexity

Solution Approach 1:

The overcoat layer serves multiple functions: it acts as a protective barrier during manufacturing, provides a precise etching mask for contact hole formation, and serves as part of the final device structure. This multi-functionality reduces the need for additional dedicated layers or processes, thereby limiting the increase in device complexity despite the enhanced contact hole precision requirements

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The color filter layer and overcoat layer are combined in the contact hole formation process, where the overcoat is deposited over the color filter and both layers are etched together in a coordinated two-step process. This merging allows the contact hole to penetrate both layers simultaneously with controlled dimensions, achieving small contact holes without requiring separate processing steps for each layer

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design significantly improves the aperture ratio of the thin film transistor array panel by reducing the contact hole size, enhancing the performance of small-sized display panels with high resolution.

Implementation Method 1

performing first dry etching using the photosensitive film pattern as a mask to etch the overcoat

Methodology Applied
Scientific EffectDry etching:

Implementation Method 2

performing second dry etching using the overcoat as a mask to etch the color filter through the preliminary contact hole

Methodology Applied
Scientific EffectDry etching:

Data Source

PatentUS9076691B2Thin film transistor array panel and method of manufacturing the same
Publication Date: 2015.07.07 TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD
  • US9076691B2 patent drawing
  • US9076691B2 patent drawing
  • US9076691B2 patent drawing

AI summary

A method of manufacturing a thin film transistor array panel includes: a gate insulating layer disposed on a gate electrode, a semiconductor disposed on the gate insulating layer, a source electrode opposite a drain electrode disposed on the semiconductor, a color filter disposed on the gate insulating layer, an overcoat disposed on the color filter and including an inorganic material. A first dry etching is performed using the photosensitive film pattern as a mask to etch the overcoat and provide a preliminary contact hole, through which a portion of the color filter is exposed. A second dry etching is performed using the overcoat as a mask to etch the color filter through the preliminary contact hole and to provide a contact hole, through which a portion of the drain electrode is exposed. A pixel electrode is connected to the drain electrode through the contact hole, on the overcoat.