TFT Array Substrate Resin Passivation Layer Process
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Solution Overview
Problem
The manufacturing process of TFT-LCD array substrates is complex and costly, leading to high production costs and product defects due to the sequential formation of channel protective and resin passivation layers.
Innovation Solution
A manufacturing method where the resin passivation layer directly covers the source/drain metal, omitting the production of a channel protective layer, and involving a series of patterning processes to form the necessary electrodes and via holes, simplifying the process and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a channel protective layer and resin passivation layer are sequentially formed after source/drain electrode formation, then the channel is protected during manufacturing, but the manufacturing cost increases and the process becomes complex
Solution Approach 1:
The invention extracts and removes the channel protective layer from the manufacturing process. The resin passivation layer is directly formed over the source/drain electrodes without requiring a separate channel protective layer, thereby simplifying the process while maintaining channel protection through the passivation layer's inherent protective properties
Solution Approach 2:
The invention merges the functions of the channel protective layer and resin passivation layer into a single resin passivation layer. This layer simultaneously provides channel protection and passivation functions, reducing the total number of layers and manufacturing steps while maintaining the necessary protective capabilities
2Manufacturing precision
If a channel protective layer is formed, then manufacturing precision is improved, but production cost increases
Solution Approach 1:
The invention removes the channel protective layer from the manufacturing sequence, eliminating the associated material costs and processing expenses while maintaining sufficient manufacturing precision through the direct formation of the resin passivation layer over the source/drain electrodes
3Manufacturing precision
If multiple patterning processes are performed, then manufacturing precision is improved, but productivity decreases
Solution Approach 1:
The invention combines the channel protection function with the resin passivation layer formation process, merging two separate manufacturing steps into one. This reduces the total number of patterning processes required while maintaining the necessary precision for electrode and via hole formation, thereby improving manufacturing throughput
Data Source
AI summary
An array substrate, a display device and a manufacturing method of the array substrate. The array substrate includes: a base substrate (1) and a plurality of pixel units located on the base substrate (1), each of the pixel units including a thin film transistor unit. The thin film transistor unit includes: a gate electrode located on the base substrate (1), a gate insulating layer (3) located on the gate electrode, an active layer (4) located on the gate insulating layer (3) and opposed to the gate electrode in position, an ohmic layer (5) located on the active layer (4), a source electrode (6a) and a drain electrode (6b) that are located on the ohmic layer (5) and a resin passivation layer (8) that are located on the source electrode (6a) and the drain electrode (6b) and covers the substrate.