Thin Film Transistor Repair via Laser Short-Circuiting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Static electricity during the manufacturing process of thin film transistor substrates can cause damage to wires and elements, leading to defective pixels due to voltage increases and short-circuits, necessitating a repair method to minimize such damage.
Innovation Solution
A thin film transistor substrate design with semiconductor-doped connection members and repairing conductors that can be short-circuited using laser irradiation to prevent static electricity damage, allowing for easy repair of damaged wires and pixels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional thin film transistor substrate structure is used, then manufacturing process is simple, but static electricity causes wire damage and pixel defects
Solution Approach 1:
The patent applies preliminary action by forming protecting conductors and connection members before the actual manufacturing process completes. These components are pre-positioned to block static electricity pathways and provide repair access points, preventing damage before it occurs to critical pixel elements
Solution Approach 2:
The patent introduces protecting conductors and connection members as intermediary elements between external static electricity sources and the vulnerable wire/pixel structures. These intermediaries intercept and redirect static electricity, preventing direct damage to the thin film transistor and associated wiring
2Ease of repair
If repairing process is needed for static electricity damage, then pixel reliability improves, but manufacturing time and complexity increase
Solution Approach 1:
The patent prepares repair infrastructure in advance by forming protecting conductors and connection members during the manufacturing process. These components are pre-configured with contact holes and conductive pathways, enabling rapid repair operations without requiring complex post-manufacturing setup
Solution Approach 2:
The patent replaces complex mechanical repair operations with simplified laser-based repair methods. The protecting conductors and connection members are designed to be easily accessed and modified using laser irradiation, substituting intricate manual or mechanical repair processes with precise, rapid energy-based modification
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively blocks externally transmitted static electricity, prevents pixel damage, and allows for easy repair of damaged wires, thereby minimizing defective pixel rates and extending the substrate's functionality.
Implementation Method 1
short-circuiting the repairing conductor and the signal line by irradiating laser to lateral ends of the signal line, overlapping lateral ends of the repairing conductor
Implementation Method 2
irradiating laser to lateral ends of the signal line, overlapping lateral ends of the repairing conductor
Data Source
AI summary
A thin film transistor substrate includes a substrate including a display area including: pixels and a periphery area where a driver for driving the pixels is disposed; first signal lines connected with the pixels and extended to the periphery area, and including first short-circuit portions provided in the periphery area; second signal lines connected with the pixels and extended to the periphery area by crossing the first signal lines in an insulated manner; first connection members overlapping lateral ends of the first signal lines, disposed in lateral sides with respect to the first short-circuited portions, and formed of a doped semiconductor; and first repairing conductors overlapping the lateral ends of the first signal lines, and disposed in the lateral sides with respect to the first short-circuited portions. Lateral ends of the first connection members are connected with the lateral ends of the first signal lines through contact holes.


