Thermal Camera Module Interface for Plug-In Host Integration
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Solution Overview
Problem
Thermal cameras face integration challenges into host devices due to non-standard electrical interfaces and unit-specific data requirements, which complicate compatibility with platform-based systems like smartphones and automobiles.
Innovation Solution
A thermal camera module (TCM) is designed with a focal plane array (FPA), read-out integrated circuit (ROIC), memory element, and control logic, allowing it to operate using standard internal interfaces and store unit-specific data, enabling plug-in compatibility without requiring per-pixel communication with the host controller.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermal cameras use non-standard electrical interfaces and require extensive unit-specific data, then they can achieve acceptable performance, but they face adoption barriers and integration challenges into host devices
Solution Approach 1:
The patent implements a standardized electrical interface that allows the thermal camera to function as a universal module compatible with multiple host devices. The camera module uses standard data busses and control protocols that can be integrated into various platforms such as smartphones, tablets, and other electronic devices, eliminating the need for custom integration solutions for each host device.
Solution Approach 2:
The patent stores all unit-specific provisioning data, calibration data, and operational parameters in memory elements within the camera module before integration. This preliminary action ensures that when the camera is integrated into a host device, no additional per-unit configuration or data loading is required, as everything is pre-configured and ready for immediate operation.
2Reliability
If thermal cameras require extensive unit-specific data for each individual camera, then they can operate with acceptable performance, but it complicates integration into mass-market host devices
Solution Approach 1:
The patent combines all unit-specific data including provisioning data, calibration data, operational parameters, and per-pixel runtime data into integrated memory elements within the camera module. This merging eliminates the need for separate data files, configuration processes, or external storage requirements, simplifying the integration process to a single module installation.
Solution Approach 2:
The camera module is designed to be self-contained with all necessary operational data stored locally in its memory elements. The module can autonomously access and use its own provisioning data and per-pixel runtime data without requiring external configuration files, host system interventions, or complex setup procedures, making it truly plug-and-play ready.
3Device complexity
If per-pixel runtime data such as bias voltages are written to the FPA by accessing memory element from a starting point address, then the FPA can operate without local processing resources or per pixel runtime communication with the host controller, but it requires a memory element and control logic
Solution Approach 1:
The patent extracts the need for complex local processing resources and per-pixel runtime communication by implementing a memory element that stores all per-pixel runtime data such as bias voltages. The control logic simply accesses this pre-stored data from a starting point address and writes it directly to the FPA, eliminating the need for sophisticated processing units or continuous host controller communication for each pixel.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The TCM achieves seamless integration into host devices by utilizing standard interfaces and minimal logic, reducing costs and simplifying operations, while maintaining image quality and compatibility with existing host platforms.
Implementation Method 1
uncooled thermal imaging devices, such as those based on bolometer focal plane arrays (FPAs)
Data Source
AI summary
Thermal cameras exist at price points and volume manufacturing suitable for practical consideration of integration of thermal camera modules into host electronic devices, including automobiles, PED's—smartphones, tablets, etc. However, individual thermal cameras require extensive unit-specific data to provision and operate each individual camera with acceptable performance. This along with non-standard electrical interfaces, are adoption barriers to host device manufacturers, for example, where some devices, including some PED's, have become bus-based platforms allowing for functional modules to be packaged into common PED's and operated by way of apps. Some modern PED's, for example, include standard high-speed data busses and low-speed control busses. Devices and methods are disclosed for delivering compatibility with standard internal interfaces and storing the camera module's unit-specific data in a memory element on the camera module. The data can be read out on the same data bus used for thermal camera image data, either by selection between stored data and video output or by simultaneous streaming on different virtual channels. In a particular embodiment the logic element may be configured to write per pixel runtime data such as bias voltages on a runtime per pixel basis to the FPA as the FPA operates by accessing the memory element from a starting point address, wherein the starting point address may be at least one of predetermined or set by a host controller, thereby allowing the FPA to operate without local processing resources or per pixel communication with the host controller.